tag: University of Stuttgart

SRAM-Based IMC For Cryogenic CMOS Using Commercial 5 nm FinFETs
By Technical Paper Link - 27 Sep, 2023 - Comments: 0

A technical paper titled “Cryogenic In-Memory Computing for Quantum Processors Using Commercial 5-nm FinFETs” was published by researchers at University of Stuttgart, Indian Institute of Technology Kanpur, University of California Berkeley, and Technical University of Munich. Abstract: "Cryogenic CMOS circuits that efficiently connect the classical domain with the quantum world are the co... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 11 Aug, 2023 - Comments: 0

Intel issued an advisory of a potential security vulnerability in some of its processors. The company recommends updating to the latest firmware version. NVIDIA unveiled its GH200 Grace Hopper platform, based on 144 Arm Neoverse cores and 282GB of HBM3e memory. Meanwhile, Chinese internet companies including Baidu, ByteDance, Tencent, and Alibaba ordered about $5 billion worth of A800 proces... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Aug, 2023 - Comments: 0

U.S. President Joe Biden issued an executive order to restrict U.S. investment in Chinese companies, targeting semiconductors and microelectronics, quantum information technologies, and artificial intelligence systems with military or intelligence applications. Specific technologies within these groups will be defined later. Some will only require investors to notify the Department of the Tre... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 14 Jul, 2023 - Comments: 0

Google was hit with a class action suit in U.S. District Court in San Francisco, alleging data scraping from millions of users without consent and violation of copyright laws to train and develop its AI products. Last month, the same law firm filed a suit against OpenAI for ChatGPT. Despite calling for a pause on development of advanced AI in March, Elon Musk launched xAI, a new company focu... » read more

Chip Industry’s Technical Paper Roundup: July 12
By Liz Allan - 12 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

An Advanced Modeling Approach For Cyclic Safety Mechanisms In A Fault Tree Analysis
By Technical Paper Link - 08 Jul, 2023 - Comments: 0

A technical paper titled "Best Practices for Advanced Modeling of Safety Mechanisms in an FTA" was published by researchers at University of Stuttgart, Robert Bosch GmbH, Audi AG, and Porsche AG. Abstract: "To cope with the megatrends electrification, automated driving, and connectivity, new functionalities and electric and/or electronic systems must be developed, which require a safe power s... » read more

Chip Industry’s Technical Paper Roundup: May 23
By Linda Christensen - 23 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=104 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Non-Traditional Design of Dynamic Logic Gates and Circuits with FDSOI FETs
By Technical Paper Link - 19 May, 2023 - Comments: 0

A new technical paper titled "Non-Traditional Design of Dynamic Logics using FDSOI for Ultra-Efficient Computing" was published by researchers at University of Stuttgart, UC Berkeley, Indian Institute of Technology Kanpur, and TU Munich, with funding by the German Research Foundation. Abstract "In this paper, we propose a non-traditional design of dynamic logic circuits using Fully-Deplet... » read more

Chip Industry’s Technical Paper Roundup: Nov. 1
By Linda Christensen - 01 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=61 /] » read more

Technical and Structural Approaches To Centralize Automotive E/E Architectures
By Technical Paper Link - 26 Oct, 2022 - Comments: 0

A technical paper titled "Methodical Approach for Centralization Evaluation of Modern Automotive E/E Architectures" was published by researchers at University of Stuttgart and Daimler Truck AG. Abstract: "Centralization is considered as a key enabler to master the CPU-intensive features of the modern car. The development and architecture change towards the next generation car is influenced ... » read more

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