tag: verification

The Trouble With Models
By Ed Sperling - 20 Dec, 2017 - Comments: 0

Models are becoming more difficult to develop, integrate and utilize effectively at 10/7nm and beyond as design complexity, process variation and physical effects add to the number of variables that need to be taken into account. Modeling is a way of abstracting the complexity in various parts of the semiconductor design, and there can be dozens of models required for complex SoCs. Some are ... » read more

Co-Modeling Takes Emulation To The Next Level: System-Of-Systems
By Ron Squiers - 14 Dec, 2017 - Comments: 0

As designs move beyond System-on-Chip (SoC) to more complex System-of-Systems (SoS), it’s essential for design teams to effectively verify that these systems function together as intended. Increasingly, system design companies are turning to emulators as the only verification platform with the capacity and performance to validate that their SoC and SoS designs function as intended. Today�... » read more

Tech Talk: Substrate Noise Coupling
By Ed Sperling - 14 Dec, 2017 - Comments: 0

Roland Jancke, head of the department for design methodology for the Fraunhofer's Engineering of Adaptive Systems Division, talks with Semiconductor Engineering about the impact of substrate noise coupling on reliability of chips and how to deal with this issue. https://youtu.be/7E2rCwYr6-o » read more

Co-modeling: A Powerful Capability For Hardware Emulation
By Mentor, a Siemens Business - 13 Dec, 2017 - Comments: 0

Understanding co-modeling technology, its impact on verification and validation should be a critical aim for anyone selecting and deploying emulation co-modeling resources. This paper explores how emulation co-modeling — specifically for the Veloce Strato emulation platform from Mentor, a Siemens business — is architected to meet the needs of advanced verification and validation. To rea... » read more

Advanced Packaging Is Suddenly Very Cool
By Ed Sperling - 11 Dec, 2017 - Comments: 2

The hottest chip markets today—automotive AI for autonomous and heavily assisted driving, machine learning, virtual and augmented reality—all are beginning to look at advanced packaging as the best path forward for improving performance and reducing power. Over the past four years, which is when 2.5D and fan-out wafer-level packaging first really began garnering interest, these and othe... » read more

UVM Can Kill You. More News At 11
By Neil Johnson - 04 Dec, 2017 - Comments: 0

Ok. I agree. Not a great title. I don’t like it either. Some pretty aggressive clickbait, I know. But it’s got the quick hit, newsy cliffhanger feel that makes you want to tune in anyway, doesn’t it? I had to go for it. For what it’s worth, it wasn’t my first choice. I wanted to go with “What You Don’t Know About UVM Can Kill You. More News at 11”. Same punch. Still the hi... » read more

Big Challenges, Changes For Debug
By Ann Mutschler - 04 Dec, 2017 - Comments: 1

By Ann Steffora Mutschler & Ed Sperling Debugging a chip always has been difficult, but the problem is getting worse at 7nm and 5nm. The number of corner cases is exploding as complexity rises, and some bugs are not even on anyone's radar until well after devices are already in use by end customers. An estimated 39% of verification engineering time is spent on debugging activities the... » read more

Using FPGAs For Emulation
By Krzysztof Szczur - 30 Nov, 2017 - Comments: 0

For many years, emulators were available only to verification teams working on the largest projects in companies with deep enough pockets. Due to size rather than capabilities they were called “Big Box” emulators and typically were used in order to recover some of the time lost on RTL simulation. Meanwhile, FPGA technology has been available long enough to mature to the point where FPGA bas... » read more

Tech Talk: Verification
By Ed Sperling - 30 Nov, 2017 - Comments: 0

Frank Schirrmeister, Cadence's senior group director for verification platforms, talks about what's changing in verification with 5G, machine learning, greater connectivity, advanced packaging, and the growing need to build security into designs. https://youtu.be/GMF8BkmdJzE » read more

High-Performance 7nm IP Verification With The AFS Platform At Silicon Creations
By Mentor, a Siemens Business - 29 Nov, 2017 - Comments: 0

While there are many benefits to migrating to smaller process geometries, such as lower power and higher performance, the increased design complexity places an even higher burden on fast and efficient simulation technology. In addition, fast and accurate resistor/capacitor (RC) extraction is becoming increasingly important. Interconnect resistance is an increasing percentage of the total path r... » read more

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