tag: verification

Quality Issues Widen
By Ed Sperling - 06 Mar, 2017 - Comments: 0

As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

Why Auto Designs Take So Long
By Ann Mutschler - 02 Mar, 2017 - Comments: 0

Designing chips for the automotive market is adding significant overhead, particularly for chips with stringent safety requirements. On the verification side it could result in an additional 6 to 12 months of work. On the design side, developing the same processor in the mobile market would take 6 fewer man months. And when it comes to complex electronic control units (ECUs) or [getkc id="81... » read more

Could DVCon Be Better?
By Brian Bailey - 23 Feb, 2017 - Comments: 0

DVCon is undoubtedly the best conference in the industry if your interest is functional verification. In the past, it has also had a slant toward design. The focus is quite simply based on the standards activity going on within [getentity id="22028" e_name="Accellera"], the EDA industry's body that turns problems into solution in a short space of time. As those standards mature, they are handed... » read more

Better Code With RTL Linting And CDC Verification
By Sergei Zaychenko - 23 Feb, 2017 - Comments: 0

Automated design rule checking, or linting, has been around in RTL verification for at least a couple decades, yet still many HDL designers completely ignore this simple yet very powerful bug hunting method. Why would a busy designer need to run this annoying warning generator? The hostility against using conventional linting tools is often explained by the enormous amount of output noise, limi... » read more

Fault Simulation Reborn
By Brian Bailey - 23 Feb, 2017 - Comments: 0

Fault simulation, one of the oldest tools in the EDA industry toolbox, is receiving a serious facelift after it almost faded from existence. In the early days, fault simulation was used to grade the quality of manufacturing test vectors. That task was replaced almost entirely by [getkc id="173" comment="scan test"] and automatic test pattern generation (ATPG). Today, functional safety is cau... » read more

Does Hardware/Software Verification Have To Be Broad And Deep? Check Out DVCon 2017
By Frank Schirrmeister - 23 Feb, 2017 - Comments: 0

DVCon 2017 is upon us next week and even though it is called the “Design and Verification” conference, it is rising more and more to the system level. One of the aspects of interest is how verification seems to simultaneously become broader—covering more aspects to verify like software, power and performance—while also becoming more deep when it comes to application domains and their sp... » read more

Find Your Way To San Jose Next Week… For DVCon, Of Course!
By Dave Kelf - 23 Feb, 2017 - Comments: 0

If you’re asked “Do you know the way to San Jose?” in the next few days, chances are it’s a newbie to DVCon. Everyone else in chip design verification knows the way to the annual Design and Verification Conference and Exhibition about to convene at the San Jose DoubleTree Hotel. This year’s program is stacking up to be an insightful and educational four days of tutorials, paper ses... » read more

Massive SoC Designs Open Doors To New Era In Simulation
By Cadence - 22 Feb, 2017 - Comments: 0

As system-on-chip (SoC) designs have grown in size, simulation technologies have had to evolve dramatically to keep pace. We’re now at an inflection point where both speed and capacity are essential and new simulation technologies are needed to meet the demands. In this paper, we’ll discuss how simulation has evolved and examine how new technologies such as the Cadence RocketSimTM Parallel ... » read more

Implementing Fan-Out Wafer-Level Packaging with Mentor Graphics
By Mentor, a Siemens Business - 06 Feb, 2017 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a new high-density packaging technology that is rapidly gaining popularity. What is it? Who needs it? How do you take advantage of it? What limitations does it have? Learn all about FOWLP and our comprehensive tool integration and support for the design and verification of FOWLP products. To read more, click here. » read more

Formal Verification Takes Safety-Critical Applications For A Drive
By Dave Kelf - 26 Jan, 2017 - Comments: 0

The high reliability of safety-critical chips for automotive applications is a well-known imperative for today’s higher-end cars and as driverless cars move closer to reality. Uber, in fact, is testing autonomous cars in Boston of all places, where aggressive driving reigns supreme and honking the horn is considered an art form. As automotive manufacturers realize that their differentiatio... » read more

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