tag: VLSI Research

Blog Review: Dec. 16
By Jesse Allen - 16 Dec, 2020 - Comments: 0

Arm's Benoit Labbe investigates why battery monitoring is so important for a low-power microcontroller and shows how it was implemented in the M0N0 MCU while drawing a fraction of a nW in typical conditions. Siemens EDA's Harry Foster takes a look at how much of their time FPGA design engineers spend on verification, and the tasks that keep verification engineers the busiest. Synopsys' Sc... » read more

Blog Review: Dec. 2
By Jesse Allen - 02 Dec, 2020 - Comments: 0

Mentor's Harry Foster investigates the effectiveness of today’s FPGA verification processes in terms of nontrivial bug escapes into production as part of the 2020 Wilson Research Group Functional Verification Study. Synopsys' Chris Clark points to how integral sensors are to the modern vehicle and key design considerations for making them more effective, safe, and reliable. Cadence's Pa... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Nov, 2020 - Comments: 0

Market research VLSI Research has raised its forecast for semiconductors and fab equipment in 2020. In its previous forecast, VLSI Research projected that the equipment market would reach $84.8 billion in 2020, up 10.1% over 2019. Now, in its latest forecast (See page 2), the equipment market is projected to hit $89.8 billion in 2020, up 16.6%. “The equipment business is booming,” said ... » read more

Blog Review: Nov. 11
By Jesse Allen - 11 Nov, 2020 - Comments: 0

Mentor's Chris Spear proposes mixing together the compactness of the field macro style with the preciseness of the do methods when writing a UVM transaction class. Cadence's Paul McLellan looks back at the history of EPROM, some of the difficulty with actually erasing it, and the subsequent development of EEPROM. Synopsys' Tuomo Untinen explains three WPA2 authentication vulnerabilities r... » read more

Blog Review: Oct. 28
By Jesse Allen - 28 Oct, 2020 - Comments: 0

Synopsys' Jacob Wilson provides some tips for how to prepare for the upcoming ISO SAE 21434 cybersecurity standard for road vehicles, starting with a security plan and understanding of risk levels. Cadence's Paul McLellan checks out Arm's first face-to-face wafer-bonded design, why it might be desirable, and some important aspects of how the proof-of-concept was developed. In a video, Men... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Oct, 2020 - Comments: 0

Chipmakers and OEMs Intel is exiting the NAND flash market. SK Hynix and Intel announced that they have signed an agreement on Oct. 20, under which SK Hynix would acquire Intel’s NAND memory and storage business for $9 billion.The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain it... » read more

Blog Review: Oct. 14
By Jesse Allen - 14 Oct, 2020 - Comments: 0

Arm's Hongsup Shin explains a machine learning application that can determine which tests are most likely to find hardware bugs, improving efficiency and reducing the number of tests that need to be run. Synopsys' Pieter van der Wolf and Dmitry Zakharov take a look at the increasing need for low power processors optimized for machine learning tasks as IoT, smart home, and wearable devices pr... » read more

Blog Review: Sept. 23
By Jesse Allen - 23 Sep, 2020 - Comments: 0

Arm's Matthew Mattina introduces a method to reduce the cost of neural network inference by combining both low-precision representation and the complexity-reducing Winograd transform while maintaining accuracy. Cadence's Paul McLellan checks out some of the biggest machine learning systems from Nvidia, Google, and Cerebras that were presented at the recent Hot Chips. Mentor's Robin Bornof... » read more

Upturn Seen In Semi Equipment Biz
By Mark LaPedus - 17 Sep, 2020 - Comments: 0

Business continues to get better in the semiconductor equipment sector. VLSI Research, for one, has raised its forecast in the arena. But there is still some uncertainty amid mixed growth for semiconductors, trade wars and other factors. After a downturn in 2019, the semiconductor equipment market expected an upturn in 2020. Then, the Covid-19 pandemic struck. Suddenly, a large percentage... » read more

Blog Review: Sept. 16
By Jesse Allen - 16 Sep, 2020 - Comments: 0

Cadence's Paul McLellan checks out what's new for TSMC's advanced packaging solutions and the ultra-low power, RF, eNVM, and CMOS image sensor specialty processes. Mentor's Ron Press points to an automated solution to measuring pattern value that provides a consistent, “apples to apples” assessment of patterns detecting defects based on the likelihood the physical defects occurring. S... » read more

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