Chip Industry Technical Paper Roundup: Nov. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=490 /] Find more semiconductor research papers here. » read more

Co-Simulation Framework for Parallel DNN Execution on Chiplet-Based Systems (UW–Madison, Washington State)


A new technical paper titled "CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems" was published by researchers at University of Wisconsin–Madison and Washington State University. Abstract "Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as ra... » read more

Chip Industry Technical Paper Roundup: August 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=467 /] Find more semiconductor research papers here. » read more

Thermally-Aware, Multi-Objective Scheduling Framework for DL Workloads on Heterogeneous Multi-Chiplet PIM Architectures (UW–Madison, Washington State)


A new technical paper titled "THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures" was published by researchers at the University of Wisconsin–Madison and Washington State University. Abstract "Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and sca... » read more

Research Bits: May 20


Smart t-shirt with sound waves Researchers at ETH Zurich developed a smart textile that uses acoustic waves passed through glass fibers to measure touch, pressure, and movement. The researchers said that using acoustic waves rather than electronics makes measurements more precise with low power consumption and the textiles lighter, more breathable, and easier to wash. It also uses readily avai... » read more

Chip Industry Technical Paper Roundup: Oct. 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Thermal Modeling For 2.5D And 3D Integrated Chiplets


A new technical paper titled "MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures" was published by researchers at University of Wisconsin–Madison, Washington State University, and University of Ulsan. Abstract: "Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D d... » read more

Research Bits: Aug. 8


Speeding NVM encryption Researchers from North Carolina State University propose a way to speed up encryption and file system performance for non-volatile memory (NVM). “NVMs are an emerging technology that allows rapid access to the data, and retains data even when a system crashes or loses power,” said Amro Awad, an assistant professor of electrical and computer engineering at North C... » read more

Memristive synaptic device based on a natural organic material—honey for spiking neural network in biodegradable neuromorphic systems


New academic paper from Washington State University, supported by a grant from the National Science Foundation. Abstract: "Spiking neural network (SNN) in future neuromorphic architectures requires hardware devices to be not only capable of emulating fundamental functionalities of biological synapse such as spike-timing dependent plasticity (STDP) and spike-rate dependent plasticity (SRDP),... » read more

System Bits: Feb. 5


Rubbery material for stretchable electronics Researchers at the University of Houston came up with a rubbery semiconducting material that they say could find applications in stretchable electronics, such as human-machine interfaces, implantable bioelectronics, and robotic skins. Cunjiang Yu, Bill D. Cook Assistant Professor of mechanical engineering at the University of Houston and correspo... » read more

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