tag: Western Digital

RISC-V: More Than a Core
By Brian Bailey - 15 Oct, 2018 - Comments: 2

The open-source RISC-V instruction set architecture (ISA) is attracting a lot of attention across the semiconductor industry, but its long-term success will depend on levels of cooperation never seen before in the semiconductor industry. The big question now is how committed the industry is to RISC-V's success. The real value that RISC-V brings is the promise of an ecosystem and the opportun... » read more

RISC-V Inches Toward The Center
By Ann Mutschler - 01 Oct, 2018 - Comments: 1

RISC-V is pushing further into the mainstream, showing up across a wide swath of designs and garnering support from a long and still-growing list of chipmakers, tools vendors, universities and foundries. In most cases it is being used as a complementary processor than a replacement for something else, but that could change in the future. What makes RISC-V particularly attractive to chipmaker... » read more

Hybrid Memory
By Ed Sperling - 13 Sep, 2018 - Comments: 0

Gary Bronner, senior vice president of Rambus Labs, talks about the future of DRAM scaling, why one type of memory won’t solve all needs, and what the pros and cons are of different memories. https://youtu.be/R0hhDx2Fb7Q » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 06 Jul, 2018 - Comments: 1

Deals SoftBank Corp. reached an agreement with Indonesia’s Link Net to work together on Internet of Things technology. Hidebumi Kitahara of SoftBank said in a statement, “The global mobile industry is now entering the 5G era, with IoT becoming the central focal point of innovation. This partnership with Link Net shows our strong commitment to further boost technology innovation in the glob... » read more

The Week In Review: Design
By Jesse Allen - 06 Apr, 2018 - Comments: 0

Tools Mentor, a Siemens business, filled in the last of the hardware configurations for its Veloce Strato emulation family, creating a full upgrade path. Users can initially purchase only the hardware that they need (StratoTiL) and if later they require more capacity (StratoTi) or the ability to handle larger designs (StratoT), they can incrementally add the necessary hardware to their existin... » read more

What Happened To Nanoimprint Litho?
By Mark LaPedus - 29 Mar, 2018 - Comments: 4

Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

Will China Succeed In Memory?
By Mark LaPedus - 19 Feb, 2018 - Comments: 5

China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Jan, 2018 - Comments: 0

Market research The SEMI Industry Strategy Symposium (ISS) opened with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming the World.” Click here for some of the highlights at ISS. Here are more highlights from ISS. Korea is on a spending spree for fab tools. In total, Samsung and SK Hynix are forecast to invest over $20 billion in fab tools worldwide in 2018... » read more

What’s Next in 3D NAND?
By Mark LaPedus - 18 Jan, 2018 - Comments: 1

In 2018, the industry needs to keep a close eye on 3D NAND as the vendor base is in the midst of some major changes. The changes involve several partnerships, including the Toshiba/Western Digital and Intel/Micron duos. It also impacts the other 3D NAND players, namely Samsung and SK Hynix. But first, demand for NAND flash memory remains robust due to the onslaught of data in systems. ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Dec, 2017 - Comments: 0

Chipmakers, LCD suppliers United Microelectronics Corp. (UMC) has announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s 55nm SST technology. Toshiba Electronic Devices & Storage has s... » read more

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