Running With O-RAN

By Mika Castren - 30 Jul, 2020 - Comments: 0

5G standards are opening the world of hardware development to anyone that can build the best, cost-effective products. At the heart of many of those products is the system on a chip (SoC) that needs to be verified within the context of the overall system. Many new companies are in 5G chip development now, delivering custom solutions that match the many configurations need for different rural an... » read more

What’s After PAM-4?

By Bryon Moyer - 23 Jun, 2020 - Comments: 1

[This is part 2 of a 2-part series. Part 1 can be found here.] The future of high-speed physical signaling is uncertain. While PAM-4 remains one of the key standards today, there is widespread debate about whether PAM-8 will succeed it. This has an impact on everything from where the next bottlenecks are likely to emerge and the best approaches to solving them, to how chips, systems and p... » read more

Power/Performance Bits: Nov. 25

By Jesse Allen - 25 Nov, 2019 - Comments: 0

Rigid or flexible in one device Researchers at the Korea Advanced Institute of Science and Technology (KAIST), Electronics and Telecommunications Research Institute (ETRI) in Daejeon, University of Colorado Boulder, Washington University in St. Louis, Cornell University, and Georgia Institute of Technology proposed a system that would allow electronics to transform from stiff devices to flexib... » read more

Should We Even Be Talking About 6G?

By Sarah Yost - 12 Nov, 2019 - Comments: 0

Friends and coworkers have been sending me a lot of articles lately about 6G, with snappy headlines that seem to suggest that 5G is already a thing of the past. As a marketing manager working on cellular technology, they want to know what I think. On the one hand, I’m excited to see that the hype surrounding 5G is shining a spotlight on wireless communications research and that visionaries ar... » read more

5G Needs Cohesive Pre- And Post-Silicon Verification

By Jean-Marie Brunet - 24 Oct, 2019 - Comments: 1

While 5G doesn’t start from a clean slate, it does make significant changes to the 4G architecture. These changes mean that the ecosystem from chips to operators is evolving, giving opportunities to more companies to engage in this growing market. Realignment in fronthaul, midhaul and backhaul In particular, the radio access network (RAN) has been redefined as Cloud RAN (sometimes called ... » read more

High-Performance DSP And Control Processing For Complex 5G Requirements

By Graham Wilson - 12 Sep, 2019 - Comments: 0

In the early 2000s, digital signal processors (DSP) were simple in architecture and limited in performance, but complex in programming. However, they evolved to meet of the increased performance requirements of 3G cellular baseband modem applications. A typical 3G modem system would have a single DSP optimized for dual/quad SIMD MAC performance with basic DSP filter instructions like Fast Fouri... » read more

5G OTA Test Not Ready For Production

By Kevin Fogarty - 09 Jul, 2019 - Comments: 0

5G is poised to dominate the wireless world, but over-the-air (OTA) testing of 5G beamforming antennas is still not ready for volume production. Beamforming is a critical element in the millimeter wave version of 5G, because of the limitations of ultra-high-frequency signals. Unlike 4G and its predecessors, millimeter wave technology will not penetrate objects, so signals need to be directed... » read more

Gearing Up For 5G

By Brian Bailey - 14 Feb, 2019 - Comments: 0

5G has been touted as the new enabler for many market segments, including mobile phones, automotive, virtual reality, and IoT. But there are many questions and much speculation about when and how this new wireless standard will impact different market segments and what effect it will have on semiconductor design. With a promise of orders of magnitude improvement in communication speed an... » read more

Affordable Design With Wireless Microcontrollers

By Sree Durbha - 06 Dec, 2018 - Comments: 0

Today, we are at the peak of technology product availability with the releases of the new iPhone models, Alexa-enabled devices, and more. In the coming days, there will be numerous international consumer OEMs preparing new offerings as we approach the holiday selling season. Along with the smartphones, voice assistant enabled smart speakers and deep learning wireless security cameras, many devi... » read more

Collaboration And Advanced Substrates

By Katherine Derbyshire - 08 Oct, 2018 - Comments: 0

Discussions of semiconductor manufacturing tend to focus on CMOS logic and memory devices, sometimes to the exclusion of everything else. Discussions of silicon-on-insulator wafer markets focus on the needs of high performance logic. Lithography analysts emphasize high density memories. It’s easy to forget that real systems contain other devices, too. A modern smartphone probably supports ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: wireless