Finding Defects In IC Packages

By Mark LaPedus - 17 Dec, 2019 - Comments: 0

Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But as packaging becomes more complex, and as it is used in markets where reliability is critical, finding defects is both more difficult and more important. This has prompted the development of a ... » read more

X-ray Detects Hidden Failure Modes

By DELTA, a part of FORCE Technology - 11 Jun, 2019 - Comments: 0

Functional testing and visual examination using stereo microscopy are today's 'standard' quality control techniques for characterising yield and workmanship-related issues in IC fabrication and electronics assembly. Currently used test methodologies—such as IPC-TM-650—rely heavily on visual examination. The visual detection of defects can still be difficult, as samples need to be inspected ... » read more

X-Ray Reveals Wire Bonding And Field Failures

By DELTA, a part of FORCE Technology - 09 Apr, 2019 - Comments: 0

Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads. It is vital that the interconnection corresponds to the product-specific bonding diagram and that the wire bonding is of an acceptable robustness and quality. X-ray technology is critical for ensuring both. To read more, click here. » read more

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tag: X-ray inspection

Finding Defects In IC Packages

X-ray Detects Hidden Failure Modes

X-Ray Reveals Wire Bonding And Field Failures

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