Software Platforms Bridge The Design/Verification Gap For 5G Communications Design

By David Vye - 15 Dec, 2016 - Comments: 0

The integration of simulation technologies, system prototyping tools, and automated test equipment is critical for addressing the complexity of developing 5G wireless technology. In these cases, design teams will need to rely on a combination of simulation and prototype testing in order to ensure design robustness. Although simulation is essential to design a test bed or prototype, measurement... » read more

An Easier Path To Faster C With FPGAs

By Zibi Zalewski - 22 Nov, 2016 - Comments: 0

For most scientists, what is inside a high-performance computing platform is a mystery. All they usually want to know is that a platform will run an advanced algorithm thrown at it. What happens when a subject matter expert creates a powerful model for an algorithm that in turn automatically generates C code that runs too slowly? FPGA experts have created an answer. More and more, the genera... » read more

Making 2.5D, Fan-Outs Cheaper

By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

The Battle To Embed The FPGA

By Brian Bailey - 31 Oct, 2016 - Comments: 1

There have been many attempts to embed an [gettech id="31071" comment="FPGA"] into chips in the past, but the market has failed to materialize—or the solutions have failed to inspire. An early example was [getentity id="22924" comment="Triscend"], founded in 1997 and acquired by [getentity id="22839" e_name="Xilinx"] in 2004. It integrated a CPU—which varied from an [getentity id="22186" co... » read more

Embedded FPGAs Going Mainstream?

By Brian Bailey - 27 Oct, 2016 - Comments: 0

Systems on chip have been made with many processing variants ranging from general-purpose CPUs to DSPs, GPUs, and custom processors that are highly optimized for certain tasks. When none of these options provide the necessary performance or consumes too much power, custom hardware takes over. But there is one type of processing element that has rarely been used in a major SoC— the [gettech id... » read more

Xilinx Zynq-based Development Platform for ADAS

By Aldec - 26 Oct, 2016 - Comments: 0

ADAS is an essential step between initial DA (Driver Assistance) systems and fully autonomous cars capable of driving without human guidance. Aldec provides an FPGA-based development platform powered by Xilinx Zynq-7000 SoC/FPGA heterogeneous technology, as well as a set of ADAS-class reference designs for rapid development of current and next-generation ADAS solutions for the automotive market... » read more

Seeing The Future Of Vision

By Jeff Dorsch - 13 Oct, 2016 - Comments: 0

Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

The Week In Review: Design

By Jesse Allen - 07 Oct, 2016 - Comments: 0

Tools Synopsys updated RSoft, its software for the design of photonic devices. The updates include increased integration with the company's TCAD products as well as faster simulations and additional ways to customize photonic device analysis. IP Mentor Graphics, Northwest Logic, and Krivi Semiconductor collaborated on DDR4 SDRAM IP to integrate design and verification into a single flo... » read more

Building Chips That Can Learn

By Ed Sperling - 29 Sep, 2016 - Comments: 0

The idea that devices can learn optimal behavior rather than relying on more generalized hardware and software is driving a resurgence in artificial intelligence, machine leaning, and cognitive computing. But architecting, building and testing these kinds of systems will require broad changes that ultimately could impact the entire semiconductor ecosystem. Many of these changes are wel... » read more

Stacked Die Changes

By Ed Sperling - 21 Sep, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?