Die-integration technologies are revolutionizing packaging, assembly and test.
The introduction of AMD’S FIJI chip a few years ago marked an important technology turning point for the semiconductor industry. This revolutionary graphics product delivered capability and innovation by relying on the first commercial example of 2.5D heterogenous integration, featuring a GPU assembled with High-Bandwidth-Memory (HBM) using Through-Silicon-Via (TSV) interconnect and interposer technologies to integrate the various subcomponent die. Since then, there have been multiple major products relying on advanced packaging to reach the market; but, perhaps more importantly, there’s been a groundswell of die-integration technologies that are revolutionizing packaging, assembly, and test. What’s driving this inflection point?
CLick here to continue reading on FormFactor’s website. This article was originally published in Semiconductor Digest.
Author: Mike Slessor, CEO, FormFactor
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