Dense, portable, scalable silicon-proven eFPGA GDS.
FPGA chips come in multiple sizes — modular blocks of programmable logic, DSP MACs and RAM are intermixed in different sizes and ratios then stitched together with top-level interconnect, clocking, etc and surrounded by a ring of I/Os like GPIO, SerDes, USB, etc. There is extensive engineering and top-level physical design for each distinct FPGA array and chip.
eFPGA is different: Customers want to use eFPGA arrays that have been silicon proven, where the GDS has not been touched. To read more, click here.
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