What comes after HBM, and why that matters for future designs.
The usual method of migrating to the next process node to cram more features onto a piece of silicon no longer works. It’s too expensive, and too limited for most applications. The path forward is now heterogeneous chiplets targeted at specific markets, and while logic will continue to scale, other features are being separated out into chiplets developed using different process technologies. This already is happening with high-bandwidth memory, and the next target is I/O. Letizia Giuliano, vice president of IP product marketing and management at Alphawave Semi, talks about the challenges of developing and integrating chiplets, where the likely problems arise, and how this differs from a homogeneous SoC.
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