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The Week In Review: Manufacturing


At an event, Samsung rolled out its 10nm finFET technology. The company also showed a 300mm wafer with 10nm finFET transistors. "We have silicon-based PDKs out," said Kelvin Low, senior director of foundry marketing for Samsung. Samsung plans to move into production with its 10nm finFET technology by the end of 2016, he said. IC Insights released its chip rankings in terms of sales in the fi... » read more

10nm Fab Challenges


After a promising start in 2015, the semiconductor equipment industry is currently experiencing a slight lull. The pause is expected to be short-lived, however. Suppliers of [getkc id="208" comment="3D NAND"] devices are expected to add more fab capacity later this year. And about the same time, foundries are expected to order the first wave of high-volume production tools for 10nm. At 10nm... » read more

The Bumpy Road To 10nm FinFETs


Foundry vendors are currently ramping up their 16nm/14nm [getkc id="185" kc_name="finFET"] processes in the market. Vendors are battling each other for business in the arena, although the migration from planar to finFETs is expected to be a slow and expensive process. Still, despite the challenges at 16nm/14nm, vendors are gearing up for the next battle in the foundry business—the 10nm nod... » read more

Waiting For Next-Gen Metrology


Chipmakers continue to march down the various process nodes, but the industry will require new breakthroughs to extend IC scaling at 10nm and beyond. In fact, the industry will require innovations in at least two main areas—patterning and the [getkc id="36" comment="Interconnect"]. There are other areas of concern, but one technology is quickly rising near the top of the list—metrology.... » read more

10nm Fab Watch


When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

One-On-One: Thomas Caulfield


Semiconductor Engineering sat down to talk about fabs, process technology and the equipment industry with Thomas Caulfield, senior vice president and general manager of Fab 8 at [getentity id="22819" comment="GlobalFoundries"]. Located in Saratoga County, N.Y., Fab 8 is GlobalFoundries’ most advanced 300mm wafer fab. What follows are excerpts of that discussion. SE: Last year, GlobalFoundr... » read more

Manufacturing Bits: May 19


Self-steering bullets DARPA has completed the development of a self-steering bullet that increases the hit rate for long-distance shots. The effort, dubbed the Extreme Accuracy Tasked Ordnance (EXACTO) program, is aimed for military snipers. The technology combines a maneuverable bullet and a real-time guidance system to track and deliver the projectile to the target, according to DARPA. It... » read more

Extending The Hardmask


In chip production, the backend-of-the-line (BEOL) is where the critical interconnects are formed within a device. Interconnects—those tiny wiring schemes in devices—are becoming more compact at each node. This, in turn, is causing a degradation in performance and an increase in the resistance-capacitance (RC) delay in chips. “The scaling roadblocks that the interconnect faces need to ... » read more

The Week In Review: Manufacturing


Cypress Semiconductor has made a bid to buy U.S. memory maker Integrated Silicon Solution Inc. (ISSI). In fact, Cypress may have started a bidding war against a Chinese consortium to buy ISSI. In March, a Chinese consortium of investors led by Summitview Capital entered into a definitive merger agreement to acquire ISSI. The proposed transaction values ISSI’s equity at approximately $639.5 mi... » read more

Manufacturing Bits: May 12


Photonic thermometers The National Institute of Standards and Technology (NIST) has developed a new class of photonic thermometers. These chip-based thermometers measure temperature using light. They are resistant to electromagnetic interference and are self-calibrating. In the future, photonic thermometers could be buried into walls or sent into space. They could be used for chemical, pres... » read more

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