Author's Latest Posts


5 Takeaways From Semicon


At the recent Semicon West trade show in San Francisco, there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs, equipment and packaging. Clearly, though, the show is much smaller with fewer attendees, as compared to past years. Most of the big companies no longer have booths. Hardly any have press events or med... » read more

Foundries Accelerate Auto Efforts


Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

Filtering Out Fab Problems


Bertrand Loy, president and CEO of Entegris, sat down to discuss the semiconductor industry, process challenges and filter technology with Semiconductor Engineering. What follows are excerpts of that conversation. SE: What is the outlook for the IC industry? Loy: A lot of positive things are happening. Eighty percent of what we do are consumables, which would be chemistries and filters. ... » read more

Manufacturing Bits: July 18


Brain microscopes Rice University is developing a tiny and flat microscope for a special application--it will be able to decode and trigger neurons on the surface of the brain. The microscope technology, dubbed FlatScope, is part of a $65 million program announced by the U.S.-based Defense Advanced Research Projects Agency (DARPA). The DARPA project, dubbed Neural Engineering System Design ... » read more

The Week In Review: Manufacturing


Market research SEMI has released its mid-year forecast at Semicon West. SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase by 19.8% to a total of $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000. In 2018, 7.7% growth is expected, resulting in an... » read more

Manufacturing Bits: July 11


China’s storage ring for EUV A group of researchers are banding together to propel the development of a storage ring technology that may one day be used as a power source for extreme ultraviolet (EUV) lithography. The collaboration includes five institutions. Researchers have organized an informal collaboration or study group with plans to develop a storage ring for EUV based on a techno... » read more

Challenges For Future Fan-Outs


The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Today, the industry is developing vari... » read more

The Week In Review: Manufacturing


Chipmakers Inotera, known as Micron Technology Taiwan, suspended its operations after an accident occurred at its Fab 2 facility in Taoyuan City on July 1, according to TrendForce. Inotera is responsible for manufacturing Micron’s LPDDR4 products that go into Apple’s supply chain for the iPhone, according to the market research firm. The problem involved a malfunction in the fab. “Th... » read more

Manufacturing Bits: July 3


MacEtch and chips Singapore’s Agency for Science, Technology and Research (A*STAR) has advanced a technology called metal-assisted chemical etching or MacEtch for use in the fabrication of silicon nanowires and related structures. Silicon nanowires are used in several applications, such as electronics, solar, storage, optical, catalysis, drug delivery and sensors. In semiconductors, the ... » read more

The Week In Review: Manufacturing


Chipmakers Toshiba and its fab partner, Western Digital, have jointly rolled out a 96-layer 3D NAND product amid a legal dispute. The companies have developed prototype samples of a 96-layer 3D NAND device. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, is scheduled for release in the second half of 2017 and mass production is targeted for 2018. Separately, ... » read more

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