Intelligent Power Allocation

The modern System-on-Chip (SoC) has higher thermal dissipation than its previous generations, because of the following factors: Increasing processor frequencies. Decreasing SoC package and device sizes. Higher levels of integration. Static power consumption trends with the most advanced SoC fabrication[1]. Faster frequencies mean faster switching, which means more power consumption... » read more

Confronting Design Challenges With Smaller Thermal Envelopes

For design engineers, physics giveth but physics can also taketh away. Consider leading-edge smartphones. Outside the improved performance that each generation gives consumers, the handsets themselves get thinner, sleeker, lighter. The reduction in the Z height is effectively a given with each new generation. In 2010, the HTC Nexus One was 11.5mm thick; this year, the Mate 8 is 7.9mm. Rem... » read more