July 2013 - Page 2 of 10 - Semiconductor Engineering

The New ASIC
By Javier DeLaCruz - 25 Jul, 2013 - Comments: 0

By Javier DeLaCruz The current state of the art For years, large ASICs like the ones used in network processing, supercomputing and high-end personal computing have had very interesting similarities. The figure below is a fairly typical floorplan of such an ASIC. After taping out over a dozen of these types of chips a year, it is interesting to see that the interfaces have changed, processo... » read more

A Brief History Of The Interconnect
By Kurt Shuler - 25 Jul, 2013 - Comments: 0

By Kurt Shuler The high functional integration of system-on-chip designs today is driving the need for new technological approaches in semiconductor design. Anyone who owns a Samsung Galaxy S4, HTC One or comparable smartphone can see the benefits of integrating onto one chip all the computing functions that were traditionally separate, discrete chips on a PC computer motherboard. For next-gen... » read more

Wearing My Computer
By Frank Ferro - 25 Jul, 2013 - Comments: 0

By Frank Ferro I have been in a friendly debate with my colleagues (to remain nameless) for some time now about the future of ‘wearable devices.’ The most recent examples are the new Google glasses and the latest incarnation of the smart watch. I’m not a fan of either. I am trying to keep an open mind, however, because my natural inclination is not to overtly wear electronics. I could ne... » read more

Drafting For First Place
By Tom De Schutter - 25 Jul, 2013 - Comments: 0

By Tom De Schutter I am a big fan of professional cycling events, and nothing can beat the Tour de France. Every year the best riders from around the world gather for what looks like an impossible task: This year they have to ride 3,404 kilometers (2,115 miles) in three weeks including five hill stages and six mountain stages. After completing that entire distance, all that separates the first... » read more

Unifying Hardware-Assisted Verification And Validation Using UVM And Emulation
By Various Writers - 25 Jul, 2013 - Comments: 0

Successful approaches to improve verification productivity are to increase the speed of verification and begin validating software/hardware integration very early in the design process. Historically, verification and validation platforms have been developed as separate flows, preventing reuse of modules and methods between the two. As a consequence, various customized verification and validatio... » read more

3D IC Supply Chain: Still Under Construction
By Barbara Jorgensen - 25 Jul, 2013 - Comments: 1

By Barbara Jorgensen and Ed Sperling Stacked die, which promise high levels of integration, a tiny footprint, energy conservation and blinding speed, still have some big hurdles to overcome. Cost, packaging and manufacturability continue to make steady progress, with test chips being produced by all of the major foundries. But in a disaggregated ecosystem, the supply chain remains a big st... » read more

New Silos Form In IC Industry
By Ed Sperling - 25 Jul, 2013 - Comments: 0

By Ed Sperling For the past couple of decades corporations around the globe have been focused on down silos. In fact, it has become a mantra. It’s considered essential for making established corporations even more successful, and it’s almost always at the center of turnaround plans for troubled companies. Moreover, across a full spectrum of companies, it’s regularly cited by management c... » read more

Measuring Verification Productivity
By Ann Mutschler - 25 Jul, 2013 - Comments: 0

By Ann Steffora Mutschler In this era of mammoth SoCs that require the utmost in verification complexity, it’s not enough to have a methodology. Design and verification teams also need to measure their productivity to constantly stay ahead of the curve. The more sophisticated customers are measuring a lot of things, explained Steve Bailey, marketing director at Mentor Graphics, “and for... » read more

GPUs May Speed UP EDA Algorithms
By Ann Mutschler - 25 Jul, 2013 - Comments: 1

The sequential EDA algorithms of old cannot keep pace with increasing design complexity, which is driving the industry to look at parallelism and other computational architectures such as the graphical processing unit (GPU). A 10X or 20X speedup for gate-level simulations means that a test that runs today in a week will run in less than a day, and a test that runs today in a month will run i... » read more

Experts At The Table: Automotive Electronics
By Ann Mutschler - 25 Jul, 2013 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss the opportunities in automotive electronics with Alexandre Palus, principal SoC architect at Altera; Aveek Sarkar, VP of product engineering & support at Apache; Mladen Nizic, engineering director, mixed signal solution at Cadence; and Stephen Pateras, product marketing director, silicon test solutions at Mentor Graphics. Wh... » read more

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