April 2014 - Semiconductor Engineering

DPA Countermeasures
By Various Writers - 30 Apr, 2014 - Comments: 0

Smartphones, tablets and other mobile devices con- tain cryptographic keys that protect payments, VPN/network connections and on-device flash memory. Although some smartphones and other devices contain countermeasures, many do not and can be easily compromised. Even a simple radio can tune into the radio frequency emissions from mobile devices and gather side channel information. In some cases,... » read more

Blog Review: April 30
By Ed Sperling - 30 Apr, 2014 - Comments: 0

Applied Materials’ Jeremy Read points to a looming problem for the Internet of Things—legacy fabs that will require software upgrades and advanced process control. Also needed: Sensors attached to thousands of machines for predictive maintenance. Foundries are now ready for production finFETs. Cadence's Richard Goering captures the buzz at last week’s TSMC Tech Symposium, where the ro... » read more

Online Everyone Is Anonymous…For Now
By Ed Sperling - 30 Apr, 2014 - Comments: 0

Every time you go online you leave a digital footprint. You store cookies and the sites you visit store your IP address, but at least for now there is no way to narrow down exactly who visited a site, whether the person you’re talking with is really who they claim to be, or even to prove it was you at the keyboard when you do use your real name. There has been much discussion about forcing... » read more

System Bits: April 29
By Ann Mutschler - 29 Apr, 2014 - Comments: 0

Beyond graphene Researchers at The University of Manchester have shown how they can control the properties of stacks of 2D materials, opening up the potential for new, previously-unimagined electronic devices. The isolation of graphene at the University in 2004 led to the discovery of many other 2D crystals and while graphene has an unrivaled set of superlatives, these crystals cover a larg... » read more

Manufacturing Bits: April 29
By Mark LaPedus - 29 Apr, 2014 - Comments: 0

Silky e-beam lithography Tufts University has put a soft and silky spin on direct-write electron-beam lithography. Researchers used common silk as the resist material, enabling the production of photonic lattices, quantum dots and other structures. This approach is a green alternative to traditional and toxic resists. The silk-based resist is developed using a water-based process. It starts... » read more

Power/Performance Bits: April 29
By Ann Mutschler - 29 Apr, 2014 - Comments: 0

Lithium-free flexible battery A Rice University laboratory has flexible, portable and wearable electronics in its sights with the creation of a thin film for energy storage. The researchers have developed a flexible material with nanoporous nickel-fluoride electrodes layered around a solid electrolyte to deliver battery-like supercapacitor performance that combines the best qualities of a h... » read more

Stopping Mask Hotspots Before They Escape The Mask Shop
By eBeam Initiative - 28 Apr, 2014 - Comments: 3

By Aki Fujimura The same types of physics-based issues that have haunted lithography for decades have started to impact mask writing as well. The increasingly small and complex mask shapes specified by optical proximity correction (OPC) that are now required for faithful wafer lithography at 28nm-and-below nodes have given rise to an increase in mask hotspots. Mask hotspots occur when the shap... » read more

Introduction To Quantum Computing
By Katherine Derbyshire - 28 Apr, 2014 - Comments: 2

Quantum computing has attracted a lot of attention lately. Recent revelations about the extent of the U.S. National Security Agency’s data collection programs, along with several large-scale corporate data breaches, have called attention to the need for secure communications. Quantum computing has potentially far-reaching implications for data security, both reducing the effectiveness of conv... » read more

The Week In Review: Design
By Ed Sperling - 25 Apr, 2014 - Comments: 0

M&A Cadence announced its intention to acquire Jasper Design Automation, adding formal technology to its roster of verification tools. The purchase price was about $146 million, the $170 million Cadence offered minus the $24 million in cash and equivalents on Jasper’s books. Tools Synopsys rolled out new LPDDR4 IP that offers up to 3.2 Gbps with low power consumption. The company is ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Apr, 2014 - Comments: 0

Worldwide semiconductor capital equipment spending is projected to total $37.5 billion in 2014, an increase of 12.2% from 2013 spending of $33.5 billion, according to Gartner. Capital spending will increase 5.5% in 2014 as the industry begins to recover from the recent economic downturn. The 3D NAND market will take longer to develop. Samsung has shipped a 3D NAND device. Micron and SK Hynix... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy