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12 Nations Sign Trade Partnership


By Taylor Sholler Last week, twelve nations across the Pacific-Rim came together to sign the Trans-Pacific Partnership (TPP) in Auckland New Zealand. These economies, making-up roughly 40 percent of the world's GDP, include Australia, Brunei, Canada, Chile, Japan, Malaysia, Mexico, New Zealand, Peru, Singapore, the U.S., and Vietnam. One of the largest trade agreements in history, the TPP will... » read more

Obama Delivers Unique State-of-the-Union Speech


By Jamie Girard On Jan. 12, President Obama delivered his eighth and final State of the Union Address to the nation. The speech is closely watch by many to signal the intent of the commander-in-chief for the coming year, but this time President Obama broke from tradition in focusing grander themes rather that specific programs. While it was decidedly a different approach to the normal laundr... » read more

China’s MEMS Foundry Business Takes Shape


By Clark Tseng Over the years, MEMS has evolved from a niche segment to a strong growth market thanks to the wide adoption from mobile devices in recent years. With the industry moving to the Internet of Things (IoT) era, MEMS will play an even more important role ─ enabling the realization of IoT environment. In the semiconductor ecosystem, China is the largest consumption market but i... » read more

SEMICON Taiwan’s Packaging Punch


SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

Challenges And Opportunities for China in the Semiconductor Industry


By Allen Lu China’s new industry investment and government promotion policies represent major opportunities for China and global semiconductor companies. The global industry is closely watching the details of the policy and its implementation ─ both because of the resources China’s government has dedicated and the potential impact to the global semiconductor manufacturing supply chain. I... » read more

It’s a Materials World, With Positive Forecast


By Michael Fury What’s the latest in materials forecasts for ALD/CVD precursors, CMP consumables, electronic gases, silicon wafers and sputtering targets? Techcet gives us an update. Metal Gate and Electrode Precursors to Double in Five Years Use of front-end Ta and W metal gate and Hf gate dielectric precursors will grow over 2.5x by 2020, according to a new report from Techcet, “20... » read more

Japan: Finding Leadership In New Technology Areas


By Osamu Nakamura The semiconductor industry is a technology-driven industry — and technology invention and innovation are the engines that drive industry growth. Japan has seen the global landscape for semiconductor manufacturing change, and in turn, Japan’s semiconductor industry has been changing, finding technology leadership opportunities in emerging technology areas that lead to grow... » read more

IoT Requires The Evolution Of The “New” 200mm Fab


By Bill Martin & Paul Werbaneth In April, we all celebrated the 50th anniversary of Moore’s Law. While critical for the industry, sometimes “chasing-the-latest-technology” business model is not the answer. Sometimes veering away from Moore’s Law makes more sense and is a better alternative. But, ever since the 1970’s, many product developer minds were conditioned that smaller w... » read more

Next-Gen Metrology: Searching For A Bright X-Ray Source


By Debra Vogler Metrology for semiconductor applications is a broad topic regardless of whether one is talking about front-end-of-line (FEOL) or back-end-of-line (BEOL) technologies. Benjamin Bunday, project manager, CD Metrology and senior member of the technical staff at SEMATECH, broke down the topic of next-generation metrology at 10nm and below into four main categories for SEMI: • I... » read more

The Roadmap To 5nm


By Debra Vogler Among the challenges the semiconductor industry will be facing as it moves down the path to node 5 are resistance-capacitance (RC) management and integration. SEMI is pleased to announce a SEMICON West 2015 STS technical program exploring these and other high-volume manufacturing challenges. According to An Steegen, SVP of Process Technology at imec, the list of RC managemen... » read more

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