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Blog Review: Feb. 7

Open-source IP; PCIe 4.0; embedded programming tips; SystemC models.

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Cadence’s Paul McLellan checks out why DARPA’s excited about open-source IP at last year’s RISC-V conference.

Synopsys’ Richard Solomon checks out what’s new in PCIe 4.0, from the 16GT/s data rate to lane margining.

Mentor’s Colin Walls shares another set of tips for embedded software developers, including when to use [ ] and exception handling.

Arm’s Jason Andrews presents a tutorial on how to create a simple SystemC model using Cycle Model Studio and run it with a Verilog testbench using EDA partner simulators.

Rambus’ Aharon Etengoff looks at bright spots for monetization of both silicon and services in the semiconductor industry.

Ansys’ Justin Hendrickson checks out how air flows in a football stadium using CFD.

NXP’s Martin Schaffer examines the new EU Cybersecurity Act and proposed certification framework to ensure devices meet security requirements.

Mentor’s Steve Pateras argues that auto makers and tier 1 suppliers need to understand the basics of testing semiconductor ICs.

Cadence’s Meera Collier considers the past and future of work, the design economy, and argues that a “jobless society” could mean an explosion of creativity.

Synopsys’ Steve Giguere considers the software and the infrastructure on which Bitcoin and other cryptocurrencies are based.

And don’t forget to check out the blogs featured in the latest IoT, Security & Automotive and Packaging, Test & Electronic Systems newsletters:

Editor In Chief Ed Sperling questions why consumers are giving up so much personal information.

Executive Editor Ann Steffora Mutschler finds that with automotive Ethernet coming on strong, it helps to implement as much as possible in hardware.

Synopsys’ Fred Bals examines whether innovation is outpacing security in automotive software.

Rambus’ Bart Stevens provides a brief history of attacking cryptography through indirect means.

Marvell’s Christopher Mash argues that fundamental changes are needed for in-vehicle networking to support a growing number of ECUs and sensors.

Achronix’s Alok Sanghavi contends that moving machine learning off the cloud requires a change in hardware design.

Flex Logix’s Geoff Tate explains why interconnects are important to eFPGAs.

Mentor’s Kevin Paul observes that failure to address electro-mechanical issues early can lead to delays and increased cost.

ClioSoft’s Ranjit Adhikary points out that you don’t have to be a big company to support academic research.

Editor In Chief Ed Sperling observes that an emphasis on heterogeneity has increased the burden on OSATs and foundries to make sure everything works as expected inside a package.

Technology Editor Jeff Dorsch questions whether test equipment will have another big year.

Advantest’s Judy Davies points to improvements in prosthetic technology with the integration of AI.

National Instruments’ David Vye, Gent Paparisto and Joel Kirshman dig into what the ideal waveform for 5G communications looks like.

The ESD Alliance’s Bob Smith checks out what’s new at this year’s Design Automation Conference.

SEMI’s Lara Chamness considers which markets and technologies will drive growth in 2018.



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