Blog Review: Jan. 10

Keysight’s Jenn Mullen explains how ChatGPT’s tools can help quality assurance (QA) engineers and software testers overcome test automation debt, and become more productive and able to deliver consistently high-quality products to market faster.

Siemens’ Keith Felton discusses how the paradigm of “shift-left” power delivery analysis has emerged as a critical methodology in addressing complexities brought by the integration of more die and chiplets into packages.

Synopsys’ Marion Gaboriau Gil shows how photorealistic rendering enables you to visualize your project in advance — and reduce the price of prototyping — by using 3D rendering software to generate lifelike images using physically based virtual lights, cameras, and materials, making it ideal for auto applications.

Cadence’s Rajneesh Chauhan introduces an error containment mechanism for CXL 3.0 called Viral and explains how it uses a new type of viral control flit, moving retry flow from the Link Layer to the Physical Layer.

Infineon’s Shreya S. talks about the working process of SIM as well as eSIM Remote SIM Provisioning (RSP) with diagrams to show the relationship between the operator and end user.

SEMI’s Serena Brischetto offers insights from the SEMI Europe Fab Management Forum, citing risk management, innovation, diversity, and collaboration as key drivers of sustainable semiconductor industry growth and fab management optimization.

Ansys’ Tobias Lauinger delves into the benefits of optical simulation and design software to help reduce or eliminate stray light picked up by an optical system’s sensor, such as in a smartphone camera.

Plus, check out the blogs featured in the latest Test, Measurement & Analytics newsletter:

Onto Innovation’s Nick Keller digs into why high-volume manufacturers of SiC power devices are adopting inline process control methods, including optical metrology techniques like Fourier transform infrared.

Synopsys’ Guy Cortez explains how Silicon Lifecycle Management (SLM) solutions, including data from embedded monitors and advanced ML algorithms, can help to identify a lower, more optimal Vmin, reducing the power of your device, extending its life, and enabling test cost savings.

NI’s Niklas Nolemo describes the effects of 5G, IoT, edge computing, AI/ML, and Open RAN architectures on wireless technology, with predictions for 2024.

Advantest’s Kevin Yan and Daniel Sun outline how test platforms for ultra-wideband (UWB) chipsets are adapting to accommodate high RF frequencies, wider bandwidth, and complex modulation schemes.

Bruker’s Inga Koehler points out why expensive lab equipment, such as the Raman microscope, sometimes falls into disuse at universities and what they can do to avoid it.