Joining Hands In The Semiconductor Industry


SEMI’s mantra is: Connect, Collaborate, Innovate. This mantra has delivered industry-enabling value to our members since SEMI’s beginnings in 1970. It has been essential for SEMI members to grow and prosper locally, while being synchronized globally. As the electronics manufacturing business has become more complex and interdependent, SEMI’s mantra has increasingly been applied across the... » read more

Designing 5G Chips


5G is the wireless technology of the future, and it’s coming fast. The technology boasts very high-speed data transfer rates, much lower latency than 4G LTE, and the ability to handle significantly higher densities of devices per cell site. In short, it is the best technology for the massive amount of data that will be generated by sensors in cars, IoT devices, and a growing list of next-g... » read more

Blog Review: Apr. 18


Cadence's Meera Collier provides an overview of five emerging technologies that could drive the semiconductor industry in the future, from carbon nanotubes to quantum computing. Mentor's Colin Walls reminds embedded software developers of a few common sense tips, including better readability with braces in C/C++ and monitoring stack overflow. Synopsys' Tim Mackey rounds up the last few we... » read more

Manufacturing Bits: April 17


Finding metallic glass Using machine learning techniques, a group of researchers have accelerated the discovery of an alloy called metallic glass. Northwestern University, the Department of Energy’s National Accelerator Laboratory and the National Institute of Standards and Technology (NIST) have devised a shortcut for discovering and improving metallic glass. In metallic glass, the at... » read more

More Lithography/Mask Challenges (Part 2)


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

Power/Performance Bits: April 17


Flexible LCDs Researchers at Donghua University and Hong Kong University of Science and Technology developed a flexible, optically rewriteable LCD for paperlike displays. The team estimates it will be cheap to produce, perhaps only costing $5 for a 5-inch screen. Optically rewriteable LCDs, like conventional LCDs, are structured like a sandwich, with a liquid crystal filling between two ... » read more

System Bits: April 17


Smartphone microscopes transformed into lab-grade devices with deep learning UCLA Samueli School of Engineering researchers have demonstrated that deep learning techniques can discern and enhance microscopic details in photos taken by smartphones in order to improve the resolution and color details of smartphone images so much that they approach the quality of images from laboratory-grade mic... » read more

SEMI Merges With ESD Alliance


SEMI unveiled plans today to merge with the ESD Alliance, the chip industry's top EDA tools group, following three similar moves by SEMI in other slices of the semiconductor supply chain. The consolidation among industry groups began several years ago, but it has accelerated recently with the rollup under SEMI's leadership of the FlexTech Alliance, the MEMS & Sensors Industry Group and the F... » read more

The CryptoManager Root Of Trust


In January 2018, Meltdown and Spectre were independently disclosed by multiple security researchers, including senior Rambus technology advisor Paul Kocher and senior Rambus security engineer Mike Hamburg. The two security flaws exploit critical vulnerabilities across a wide range of modern processors, including Intel, ARM and AMD. Notably, however, existing RISC-V processors remain unaffected ... » read more

Tech Talk: Analog Simplified


Benjamin Prautsch, Fraunhofer EAS' group manager for advanced mixed-signal automation, talks about how to simplify and speed up analog IP development, its role in IoT and IIoT/Industry 4.0, and why this is becoming so important for advanced packaging and advanced process nodes. https://youtu.be/6ISL1A7Wy_I » read more

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