Right-Sized Security
By Paul Karazuba - 12 Jun, 2018 - Comments: 0

Security is a key design consideration of any connected product. Nefarious parties can and will attempt to exploit security flaws in order to capture sensitive data, gain device control, or for a myriad of other reasons. When considering security needs and implementation in their systems, Device OEMs must balance a number of factors. Security is obviously a very important factor; however, de... » read more

Power/Performance Bits: June 12
By Jesse Allen - 12 Jun, 2018 - Comments: 0

AI for solar materials In the search for better organic photovoltaic materials, researchers at Osaka University turned to machine learning to help identify candidates. While organic photovoltaics (OPVs) are promising on a cost basis, they do not yet have the required power conversion efficiency (PCE) necessary for commercialization. A key element in this is the semiconducting polymer layer. ... » read more

New Transistor Types Vs. Packaging
By Ed Sperling - 11 Jun, 2018 - Comments: 0

Plans are being formulated for the rollout of multiple types of gate-all-around FETs and literally dozens of advanced packaging options. The question now is which ones will achieve critical mass, because there aren't enough chips in the world to support all of them profitably. FinFETs, which were first introduced by Intel at 22nm, are running out of steam. While they will survive 10/7nm, and... » read more

Sacrificial Laser Release Materials For RDL-First Fan-Out Packaging
By Brewer Science - 11 Jun, 2018 - Comments: 0

The semiconductor industry is in a new age where device scaling will not continue to provide the cost reductions or performance improvements at a similar rate to past years when Moore’s law was the guiding principle for IC scaling. The cost of scaling below 7 nm nodes is rising substantially and requires significant investment in capital equipment and R&D spending for next-generation lithogra... » read more

The Growing Materials Challenge
By Katherine Derbyshire - 11 Jun, 2018 - Comments: 0

By Katherine Derbyshire & Ed Sperling Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems. Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips contin... » read more

The Best in Test
By Jeff Dorsch - 11 Jun, 2018 - Comments: 0

“The 10 Best Semiconductor Equipment Supplier Rankings for 2018” was recently released by VLSI Research. Teradyne and Advantest placed first and second, respectively, in the large-company rankings, each rating five stars, based on evaluations by customers. Xcerra placed fifth in the focused-company rankings, with four-and-a-half stars. The market research firm also ranked the top vendors... » read more

Generating And Debugging Constraints For High-Speed Serial Instruments
By NI - 11 Jun, 2018 - Comments: 0

This white paper addresses the specific need for designing constraints into your NI PXIe-6591R or PXIe-6592R High Speed Serial project. Constraints are an often overlooked requirement of the project and can take several weeks to analyze timing requirements on a design, implement constraints, and achieving successful compilations that pass timing. This guide will help reduce the amount of time s... » read more

Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers
By Kim Yess - 11 Jun, 2018 - Comments: 0

Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for itself in the next generation of ultrathin wafer manufacturing. Semiconductor wafers are being forced to become thinner as the push to shrink feature sizes and introduce full-scale 3D integration ... » read more

Extending The IC Roadmap
By Mark LaPedus - 11 Jun, 2018 - Comments: 0

An Steegen, executive vice president of semiconductor technology and systems at Imec, sat down with Semiconductor Engineering to discuss IC scaling and chip packaging. Imec is working on next-generation transistors, but it is also developing several new technologies for IC packaging, such as a proprietary silicon bridge, a cooling technology and packaging modules. What follows are excerpts of t... » read more

Tech Talk: 5G Everywhere
By Ed Sperling - 11 Jun, 2018 - Comments: 0

Sarah Yost, senior product marketing manager at National Instruments, talks about the promise of 5G, where it works and where it doesn’t work, and why it’s so critical for so many different markets. https://youtu.be/CzxdrrhSvGY » read more

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