Xcerra: Back to the Drawing Board
By Jeff Dorsch - 05 Mar, 2018 - Comments: 0

It’s been nearly two weeks since Xcerra and Hubei Xinyan Equity Investment Partnership announced they have terminated their merger agreement in the face of apparent opposition by the Committee on Foreign Investment in the United States, the federal interagency panel that reviews transactions for their impacts on national security. Xcerra and Hubei Xinyan also withdrew their CFIUS application.... » read more

5G New Radio Signal Design
By David Vye - 05 Mar, 2018 - Comments: 0

By Gent Paparisto, Joel Kirshman, and David Vye The CP-OFDM modulation scheme will have many options. Variable subcarrier spacing (SCS) will be 3.75, 15, 30, 60, 120, 240, 480 kHz with sub-1 GHz of 15 and 30 kHz and sub-6 GHz of 15, 30, and 60 kHz, and above 6 GHz of 60 and 120 kHz. There will be normal and extended CP options. Slot duration will be 0.5 ms, subframe curation will be 1 ms, an... » read more

Toward High-End Fan-Outs
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

TATA Motors Builds HIL Test System For Hybrid Vehicle Simulation Using NI Tools
By NI - 05 Mar, 2018 - Comments: 0

The Challenge: Developing a scalable, flexible, and universal hardware-in-the-loop (HIL) platform to validate the integration of multiple electronic control units (ECUs) for a parallel hybrid vehicle. The Solution: Using the scalability of the PXI platform and the out-of-the-box functionality of NI VeriStand software to build a test system that could test six interconnected vehicle ECUs toge... » read more

Finding Faulty Auto Chips
By Mark LaPedus - 05 Mar, 2018 - Comments: 1

The next wave of automotive chips for assisted and autonomous driving is fueling the development of new approaches in a critical field called outlier detection. KLA-Tencor, Optimal+, as well as Mentor, a Siemens Business, and others are entering or expanding their efforts in the outlier detection market or related fields. Used in various industries for several years, outlier detection is one... » read more

Innovative Integration Solutions For SiP Packages Using Fan-Out Wafer Level eWLB Technology
By STATS ChipPAC - 05 Mar, 2018 - Comments: 0

Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduced overall form factor as well as cost effective... » read more

Better Living Through Microelectronics
By Judy Davies - 05 Mar, 2018 - Comments: 0

The recently completed 2018 Winter Olympic Games left many of us in awe of the athleticism on display. But this month’s 2018 Winter Paralympic Games, also being held in PyeongChang, South Korea, could be an even more impressive showcase of both skills and heart. Competitors from around the world will include athletes with a range of physical, intellectual and visual disabilities. Of course, t... » read more

Looking At Test Differently
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Wilhelm Radermacher, executive advisor at [getentity id="22816" e_name="Advantest"], sat down with Semiconductor Engineering to discuss how the impact of rapid market changes, advanced packaging approaches and increasing complexity on test strategies and equipment. What follows are excerpts of that conversation. SE: As we move into new markets where use models and stresses on devices are dif... » read more

Bosch Visiontec Case Study
By Mentor, a Siemens Business - 05 Mar, 2018 - Comments: 0

The BOSCH Visiontec team innovates assisted and autonomous driving technology. This team develops state-of-the-art IPs and ICs containing high-performance processors that implement algorithms to recognize images from cameras in automobiles. They were tasked to create several brand-new designs that implemented mathematically-intense algorithms in less than a year. The specifications of these des... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Mar, 2018 - Comments: 0

Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

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