What EUV Brings To The Table
By Moshe Preil - 15 Feb, 2018 - Comments: 0

After many years of hearing that EUV is almost ready for prime time, the tide is finally coming in. A decade of slow but steady progress has resulted in exposure tools that can expose on the order of 1,000 wafers a day on a regular basis. This may be shy of the requirements for high volume manufacturing (HVM), but it is certainly more than enough to support solid development programs and pilot ... » read more

Understanding Memory
By Alex Yoon - 15 Feb, 2018 - Comments: 10

New semiconductor applications are ever changing and improving our lives, from new smartphones and wearables to healthcare, factory automation, and artificial intelligence. The humble memory chip working in the background plays a critical role in enabling these technologies. For example, that awesome picture you just took would be lost forever without memory. Your computer can’t perform the i... » read more

What’s Next In Neuromorphic Computing
By Katherine Derbyshire - 15 Feb, 2018 - Comments: 2

To integrate devices into functioning systems, it's necessary to consider what those systems are actually supposed to do. Regardless of the application, [getkc id="305" kc_name="machine learning"] tasks involve a training phase and an inference phase. In the training phase, the system is presented with a large dataset and learns how to "correctly" analyze it. In supervised learning, the data... » read more

SoC + AI = SiPx
By Rich Wawrzyniak - 15 Feb, 2018 - Comments: 0

The market for third-party semiconductor intellectual property (SIP) continues to exhibit growth well beyond the (CAGR) Compound Annual Growth Rate for the semiconductor industry. Semico just completed an in-depth analysis and breakdown of the SIP market in a report called Licensing, Royalty and Service Revenues For 3rd Party SIP (SC105-18). The 2017 to 2022 CAGR is projected to be 10.9%, about... » read more

What’s On Display
By Max McDaniel - 15 Feb, 2018 - Comments: 0

Displays provide the window between consumers and the information universe. There is no place like CES, held recently in Las Vegas, to see the most exciting new and future displays. Beyond traditional technologies like television, displays also featured prominently in many of the big trends at the show: AI (Artificial Intelligence), automotive, virtual reality, IoT (Internet of Things) and conn... » read more

Transistor Options Beyond 3nm
By Mark LaPedus - 15 Feb, 2018 - Comments: 18

Despite a slowdown in chip scaling amid soaring costs, the industry continues to search for a new transistor type 5 to 10 years out—particularly for the 2nm and 1nm nodes. Specifically, the industry is pinpointing and narrowing down the transistor options for the next major nodes after 3nm. Those two nodes, called 2.5nm and 1.5nm, are slated to appear in 2027 and 2030, respectively, accord... » read more

Europe’s New R&D Program
By Emir Demircan - 15 Feb, 2018 - Comments: 0

European Union (EU) research, development and innovation programs have proved successful in recent decades. The current framework program (FP) Horizon 2020, with its 80 billion EUR total budget – around 17 billion EUR of which is allocated for Industrial Leadership – has produced unparalleled collaboration opportunities that no single European country can match on its own. FPs are strate... » read more

New Nodes, Materials, Memories
By Ed Sperling - 15 Feb, 2018 - Comments: 0

Ellie Yieh, vice president and general manager of Advanced Product Technology Development at [getentity id="22817" e_name="Applied Materials"], and head of the company's Maydan Technology Center, sat down with Semiconductor Engineering to talk about challenges, changes and solutions at advanced nodes and with new applications. What follows are excerpts of that conversation. SE: How far can w... » read more

EUV Reticle Print Verification With Advanced Broadband Optical Wafer Inspection And e-Beam Review Systems
By KLA - 14 Feb, 2018 - Comments: 0

As the Extreme Ultraviolet (EUV) lithography ecosystem is being actively mapped out to enable sub-7nm design rule devices, there is an immediate and imperative need to identify the EUV reticle (mask) inspection methodologies. The introduction of additional particle sources due to the vacuum system and potential growth of haze defects or other film or particle depositions on the reticle, in comb... » read more

Blog Review: Feb. 14
By Jesse Allen - 14 Feb, 2018 - Comments: 0

Mentor's Matthew Hogan takes a look at why it's important to establish a baseline reliability verification process and how foundry rule decks fit in. Synopsys' Robert Vamosi digs into the issues with fitness tracker Strava's heatmap, how it could be manipulated, and why the risks of big data analytics go beyond wearables. Cadence's Paul McLellan points to research showing how easy it can ... » read more

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