AUTOSAR And FlexRay


This paper describes ways tools are quickly becoming the foundation for optimization processes that help engineers design profitable automotive products more efficiently than ever before. Standards are the enabling platform for the modern computer-based design tools that have transformed industries around the world. AUTOSAR is a leading effort to bring some standardization to the software platf... » read more

One-on-One: Steven Woo


Semiconductor Engineering sat down with Steven Woo, vice president and distinguished inventor at [getentity id="22671" e_name="Rambus"], to talk about the IoT and where the real problems are showing up. SE: What are the big challenges as we move toward an [getkc id="76" comment="Internet of Things"]-connected world? Woo: The challenges we see, moving forward aren’t particularly related... » read more

Enabling ISO 26262 Qualification


ISO 26262 focuses on the functional safety of electrical and electronic systems that are installed in series production passenger cars. This adaptation of IEC 61508 is for the automotive sector and affects all systems containing software- or hardware-based electrical, electronic, or electromechanical components. ISO 26262 covers many aspects of safety-related automotive software production, i... » read more

What Ford Is Driving


Jim Buczkowski, director of electrical and electronics systems research and advanced engineering at Ford Motor Co., sat down with Semiconductor Engineering to talk about quality, security, architectures, packaging and automotive's unique constraints. What follows are excerpts of that conversation. SE: As more electronic content is included in automobiles, what kinds of issues are you dealing... » read more

Blog Review: March 4


Is gate-level simulation still necessary? Mentor's Gordon Allan asserts it is, and gives a list of reasons why the pain is worth the peace of mind. Synopsys' Aron Pratt concludes his series on parameterization strategies with a process that allows the testbench to make use of parameterized interfaces without imposing limits on VIP access. Should you use EUV or quadruple patterning for 7nm... » read more

More Lithography Options?


Lithographers face some tough decisions at 10nm and beyond. At these nodes, IC makers are still weighing the various patterning options. And to make it even more difficult, lithographers could soon have some new, and potentially disruptive, options on the table. On one front, the traditional next-generation lithography (NGL) technologies are finally making some noticeable progress. For examp... » read more

System Bits: March 3


Observing antiferromagnetic order in ultracold atoms Rice University researchers have simulated superconducting materials and made headway on a problem that’s vexed physicists for nearly three decades using ultracold atoms as a stand-in for electrons. The research team, led by Rice, included researchers from Ohio State University, Universidade Federal do Rio de Janeiro, University of Cal... » read more

Manufacturing Bits: March 3


Nanoimprint consortium CEA-Leti has launched a nanoimprint lithography program in an effort to propel the technology in the marketplace. The imprint program, dubbed Inspire, will focus on various and emerging non-semiconductor applications, according to Laurent Pain, patterning program manager and business development manager within the Silicon Technologies division at the French R&D or... » read more

Power/Performance Bits: March 3


Black phosphorus photodetectors Phosphorus, a highly reactive element commonly found in match heads, tracer bullets, and fertilizers, can be turned into a stable crystalline form known as black phosphorus. In a new study, researchers from the University of Minnesota used an ultrathin black phosphorus film 20 atoms thick to demonstrate high-speed data communication on nanoscale optical circui... » read more

NXP To Buy Freescale For $16.7B


By Ann Steffora Mutschler & Ed Sperling Dutch semiconductor giant NXP Semiconductors will buy Texas-based Freescale Semiconductor for $16.7 billion—$11.8 billion in cash, $5.6 billion worth of debts, minus $696 million in cash reserves—creating a combined company with a broad-based product portfolio and projected annual revenue of more than $10 billion. Given the size of the deal... » read more

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