Fabless Approach To Embed Active Nanophotonics in Bulk CMOS By Co-Designing The BEOL Layers For Optical Functionality (MIT)
By Technical Paper Link - 11 Oct, 2023 - Comments: 0

A technical paper titled “Metal-Optic Nanophotonic Modulators in Standard CMOS Technology” was published by researchers at Massachusetts Institute of Technology. Abstract: "Integrating nanophotonics with electronics promises revolutionary applications ranging from light detection and ranging (LiDAR) to holographic displays. Although semiconductor manufacturing of nanophotonics in Silicon ... » read more

Applying Machine Learning to EDA, FPGA Design Automation Tools
By Technical Paper Link - 11 Oct, 2023 - Comments: 0

A technical paper titled “Application of Machine Learning in FPGA EDA Tool Development” was published by researchers at the University of Texas Dallas. Abstract: "With the recent advances in hardware technologies like advanced CPUs and GPUs and the large availability of open-source libraries, machine learning has penetrated various domains, including Electronics Design Automation (EDA). E... » read more

The Value Of Field Solvers In Semiconductor Development Helps Drive Infineon Innovation
By Siemens EDA - 11 Oct, 2023 - Comments: 0

Parasitic extraction (PEX) helps ensure accurate circuit performance in the design and verification flow. Development of accurate PEX runsets depends on accurate and precise extraction results obtained using a full-featured field solver. Infineon selected the Calibre xACT 3D tool as their reference field solver tool of choice in the development of their next-generation semiconductor power produ... » read more

How Multi-Die Systems Are Transforming Electronic Design
By Synopsys - 11 Oct, 2023 - Comments: 0

How can the electronics industry continue as Moore’s law slows, system complexity increases, and the number of transistors balloons to trillions? Multi-die systems have emerged as the solution to go beyond Moore’s law and address the challenges of systemic complexity, allowing for accelerated, cost-effective scaling of system functionality, reduced risk and time to market, lower system p... » read more

Maximizing Design Flexibility For Multi-Layered And Diffractive Optical Components
By Ansys - 11 Oct, 2023 - Comments: 0

A broad range of optical devices use nanostructured layers and surfaces to manipulate beams of light through diffraction and interference. Example devices include diffraction gratings, metasurfaces, diffractive optical elements, and metalenses. While the purpose and function of these devices can differ, they offer similar challenges from the point of view of simulation. In this white paper, ... » read more

Issues In Calculating Glitch Power
By Ed Sperling - 11 Oct, 2023 - Comments: 0

The amount of power consumed by redundant non-functional toggles, or glitch power, can be as high as 35% of total power consumption in a design. What can be done about that? Godwin Maben, low-power architect and scientist at Synopsys, takes a deep dive into the causes of glitch, how it is affected by new process nodes and heterogeneous integration, and the impact of different workloads, higher ... » read more

Blog Review: October 11
By Jesse Allen - 11 Oct, 2023 - Comments: 0

Cadence's Sangeeta Soni examines Integrity and Data Encryption (IDE) verification considerations for Compute Express Link (CXL) devices, including MAC generation and handling, key programming and exchange, and early MAC termination. Synopsys' Madhumita Sanyal points to how the increased bandwidth of PCIe 6.0 supports the demanding requirements of AI accelerators. Siemens' Kevin Webb expla... » read more

Satellites Bolster 5G Through Non-Terrestrial Networks
By Keysight - 11 Oct, 2023 - Comments: 0

The 3GPP plans to make 5G into a network that incorporates satellites to augment terrestrial 5G networks. These NTNs will extend the reach of 5G to regions lacking terrestrial infrastructure. Click here to read more. » read more

Using Smart Data To Boost Semiconductor Reliability
By Laura Peters - 10 Oct, 2023 - Comments: 0

The chip industry is looking to AI and data analytics to improve yield, operational efficiency, and reduce the overall cost of designing and manufacturing complex devices. In fact, SEMI estimates its members could capture more than $60B in revenues associated through smart data use and AI. Getting there, however, requires overcoming a number of persistent obstacles. Smart data utilization is... » read more

Optimizing Metal Film Measurement On IGBT And MOSFET Power Devices With Picosecond Ultrasonic Technology
By Johnny Dai - 10 Oct, 2023 - Comments: 0

By Johnny Dai with Cheolkyu Kim and Priya Mukundhan In recent years, power semiconductor applications have expanded from industrial and consumer electronics to renewable energy and electric vehicles. Looking to the future, the most promising power semiconductor devices will be insulated gate bipolar transistor (IGBT) and power metal oxide semiconductor field effect transistor (power MOSFET) ... » read more

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