Boost SoC Efficiency And Speed With FlexGen Smart NoC IP Automation


Today’s high-end SoCs contain many heterogeneous processing elements to address the needs of HPC and AI applications. These include Central Processing Units (CPUs), Graphics Processing Units (GPUs), Neural Processing Units (NPUs), Tensor Processing Units (TPUs), and other hardware accelerators. Furthermore, IPs may contain clusters of these processor cores, and SoC subsystems may include arra... » read more

What Scares Chip Engineers About Generative AI


Experts At The Table: LLMs and other generative AI programs are a long way away from being able to design entire chips on their own from scratch, but the emergence of the tech has still raised some genuine concerns. Semiconductor Engineering sat down with a panel of experts, which included Rod Metcalfe, product management group director at Cadence; Syrus Ziai, vice-president of engineering at E... » read more

Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many-Core RISC-V SoC


Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. This white paper analyzes the impact of mat... » read more

Cracking The Memory Wall


Processor performance continues to improve exponentially, with more processor cores, parallel instructions, and specialized processing elements, but it is far outpacing improvements in bandwidth and memory. That gap, the so-called memory wall, has persisted throughout most of this century, but now it is becoming more pronounced. SRAM scaling is slowing at advanced nodes, which means SRAM takes ... » read more

Testing Analog And Digital Components In Modern PCBAs


Modern printed circuit board assemblies (PCBAs) are designed to support increasingly complex applications in industries such as telecommunications, automotive, consumer electronics, and industrial automation. Many applications require analog and digital components to function seamlessly within a single board. This integration of analog and digital technologies requires comprehensive testing to ... » read more

Low-Temp Pressure-Assisted Liquid-Metal Printing for Oxide-TFTs


A new technical paper titled "Low-temperature pressure-assisted liquid-metal printing for β-Ga2O3 thin-film transistors" was published by researchers at UCSD and National Tsing Hua University. Abstract "Developing a low-temperature and cost-effective manufacturing process for energy-efficient and high-performance oxide-thin-film transistors (TFTs) is a crucial step toward advanci... » read more

Machine Learning-Based IR Drop Prediction Approach


A new technical paper titled "Estimating Voltage Drop: Models, Features and Data Representation Towards a Neural Surrogate" was published by researchers at KTH Royal Institute of Technology and Ericsson Research. ABSTRACT "Accurate estimation of voltage drop (IR drop) in modern Application-Specific Integrated Circuits (ASICs) is highly time and resource demanding, due to the growing complex... » read more

Research Bits: Feb. 25


Recording synaptic connections Researchers from Harvard University built a silicon chip capable of recording synaptic signals from a large number of neurons and used it to catalogue more than 70,000 synaptic connections from about 2,000 rat neurons. They hope the device is a step in creating a detailed synaptic connection map of the brain. The chip contains an array of 4,096 microhole elect... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

Design Space For The Device-Circuit Codesign Of NVM-Based CIM Accelerators (TSMC)


A new technical paper titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by TSMC researchers. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devices. Nonvolatile memory (NVM) devices offer one s... » read more

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