Hardware Virtualization Support in the RISC-V CVA6 Core
By Technical Paper Link - 08 Mar, 2023 - Comments: 0

A new technical paper titled "CVA6 RISC-V Virtualization: Architecture, Microarchitecture, and Design Space Exploration" was published (preprint) by researchers at Universidade do Minho, University of Bologna, and ETH Zurich. Abstract "Virtualization is a key technology used in a wide range of applications, from cloud computing to embedded systems. Over the last few years, mainstream comp... » read more

Large Area Synthesis of 2D Material Hexagonal Boron Nitride, Improving Device Characteristics of Graphene
By Technical Paper Link - 08 Mar, 2023 - Comments: 0

A new technical paper titled "Large-area synthesis and transfer of multilayer hexagonal boron nitride for enhanced graphene device arrays" was published by researchers at Kyushu University, National Institute of Advanced Industrial Science and Technology (AIST), and Osaka University. Abstract "Multilayer hexagonal boron nitride (hBN) can be used to preserve the intrinsic physical properti... » read more

A Hierarchical And Tractable Mixed-Signal Verification Methodology For First-Generation Analog AI Processors
By Siemens EDA - 08 Mar, 2023 - Comments: 0

Artificial intelligence (AI) is now the key driving force behind advances in information technology, big data and the internet of things (IoT). It is a technology that is developing at a rapid pace, particularly when it comes to the field of deep learning. Researchers are continually creating new variants of deep learning that expand the capabilities of machine learning. But building systems th... » read more

Blog Review: March 8
By Jesse Allen - 08 Mar, 2023 - Comments: 0

Synopsys' Rahul Thukral and Bhavana Chaurasia find that embedded MRAM is undergoing an uplift in utilization for low-power, advanced-node SoCs thanks to its high capacity, high density, and ability to scale to lower geometries. Siemens EDA's Chris Spear dives into the UVM Factory with a look at the  SystemVerilog Object-Oriented Programming concepts behind the factory. Cadence's Veena Pa... » read more

What’s At Stake In System Design?
By Cadence - 08 Mar, 2023 - Comments: 0

What You Will Gain From This eBook: Power and Signal Integrity Insights into harmonic balancing and crosstalk analysis Learning about loop gain and transmission rates Examining the necessity of power-aware systems Electromagnetic Analysis Knowledge about the state of electromagnetics in wireless networks Insight into RADAR and LiDAR EM profiles Tips for bending, meshin... » read more

How Low Can You Go? Pushing The Limits Of Transistors
By Synopsys - 08 Mar, 2023 - Comments: 0

Deep low voltage enablement of embedded memories and logic libraries to achieve extreme low power: Rising demand for cutting-edge mobile, IoT, and wearable devices, along with high compute demands for AI and 5G/6G communications, has driven the need for lower power systems-on-chip (SoCs). This is not only a concern for a device’s power consumption when active (dynamic power), but also when... » read more

17 Equations That Changed The World
By Ansys - 08 Mar, 2023 - Comments: 0

Mathematics has been a constant part of our lives forever and is used in many ways in our everyday lives. Created by Ian Stewart, listed on Dr. Paul Coxon’s Twitter account, and discussed on mathematics blogger Larry Philip’s site is a list of the “17 Equations that Changed the World,” many of which have been mentioned on The Big Bang TheoryTV series. However, the list is incomplete.... » read more

Learn The Architecture — Memory System Resource Partitioning And Monitoring (MPAM) Overview
By Arm - 08 Mar, 2023 - Comments: 0

This guide introduces the Memory System Resource Partitioning and Monitoring (MPAM), an optional addition to the Arm architecture to support memory system partitioning. MPAM is documented in the Memory System Resource Partitioning and Monitoring (MPAM), for A-profile architecture Arm Architecture Reference Manual Supplement. Click here to read more. » read more

Startup Funding: February 2023
By Jesse Allen - 08 Mar, 2023 - Comments: 0

The cost of borrowing is going up, but investors continued to pour money into the chip industry in February. Collectively, 132 companies raised more than $4.5 billion last month. One of the big beneficiaries was quantum computing, with nine companies drawing a total of more than $500 million. The bulk of that went to a quantum software and services company spun out of Alphabet, but plenty wa... » read more

Metrology Strategies For 2nm Processes
By Laura Peters - 07 Mar, 2023 - Comments: 3

Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are taking on the increasingly 3D nature of structures and the new materials they incorporate. For instance, processes like hybrid bonding, 3D NAND flash devices, and nanosheet FETs are pushing the bo... » read more

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