Securing DRAM Against Evolving Rowhammer Threats
By Aharon Etengoff - 07 Mar, 2024 - Comments: 0

Advanced process nodes and higher silicon densities are heightening DRAM's susceptibility to Rowhammer attacks, as reduced cell spacing significantly decreases the hammer count needed for bit flips. Rowhammer exploits DRAM’s single-capacitor-per-bit design to trigger bit flips in adjacent cells through repeated memory row accesses. This vulnerability allows attackers to manipulate data, re... » read more

Maximizing Energy Efficiency For Automotive Chips
By William Ruby - 07 Mar, 2024 - Comments: 0

Silicon chips are central to today’s sophisticated advanced driver assistance systems, smart safety features, and immersive infotainment systems. Industry sources estimate that now there are over 1,000 integrated circuits (ICs), or chips, in an average ICE car, and twice as many in an average EV. Such a large amount of electronics translates into kilowatts of power being consumed – equiva... » read more

Microarchitecture Vulnerabilities: Uncovering The Root Cause Weaknesses
By Jason Oberg - 07 Mar, 2024 - Comments: 0

In early 2018, the tech industry was shocked by the discovery of hardware microarchitecture vulnerabilities that bypassed decades of work put into software and application security. Meltdown and Spectre exploited performance features in modern application processors to leak sensitive information about victim programs to an adversary. This leakage occurs through the hardware itself, meaning th... » read more

V2X Path To Deployment Still Murky
By Ann Mutschler - 07 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and the path to deployment, with Shawn Carpenter, program director for 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

Semiconductors Beyond Nanometers
By Andreas Schumacher - 07 Mar, 2024 - Comments: 0

In today's world, semiconductors are essential components of our everyday lives and the backbone of our economies. From the devices we use to communicate to the machines that power our factories, semiconductors are the building blocks that enable digitalization and decarbonization. However, public and policy debates about semiconductors often focus solely on their smallest feature size, measure... » read more

AI Performance And Real-Time Control In Robotics And Autonomous Applications
By Shingo Kojima - 07 Mar, 2024 - Comments: 0

Recent vision AI models have to deal with dynamic and complex environments, resulting in the need for more power efficiency and speed in real-time applications. To meet the market needs, Renesas released the next-generation Dynamically Reconfigurable Processor for AI (DRP-AI) accelerator. The DRP-AI accelerator delivers high-power efficiency of 10 TOPS/W, up to 10 times higher than the conve... » read more

Digital Twins And AI Acceleration Are Transforming System Design
By Steve Brown - 07 Mar, 2024 - Comments: 0

We are at a global inflection point as we cope with the limitations of energy supply and the consequences of climate change. Regional conflicts are elevating risks in the traditional crude oil supply chain. Changes in rainfall patterns and disputes over water use priorities are limiting hydroelectric power generation. Moreover, extreme weather events have intensified the threat to lives and pro... » read more

Complex Safety Mechanisms Require Interoperability And Automation For Validation And Metric Closure
By Siemens EDA - 06 Mar, 2024 - Comments: 0

The race to autonomous mobility among the automobile manufacturers is driving the evolution of the underlying semiconductors. As a result, semiconductor technologies are moving towards higher densities and lower operating voltages, and this migration is introducing increasing sensitivity to random hardware failures – the failures which occur unpredictably over a semiconductor’s lifetime. Mo... » read more

Chiplet IP Standards Are Just The Beginning
By Ann Mutschler - 06 Mar, 2024 - Comments: 2

Experts at the Table: Semiconductor Engineering sat down to talk about chiplet standards, interoperability, and the need for highly customized AI chiplets, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen S... » read more

Blog Review: Mar. 6
By Jesse Allen - 06 Mar, 2024 - Comments: 0

Synopsys' Gandharv Bhatara notes that successfully deploying high-NA EUV will rely on computational lithography to provide accurate modeling of aberrations, compact 3D mask modeling, and expand inverse lithography to full-chip processing. Cadence's John Park argues for using a systematic and automated system for co-design and co-analysis of multi-die packages to reduce the margin for human e... » read more

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