Startup Funding: February 2024

By Jesse Allen - 06 Mar, 2024 - Comments: 0

A startup developing AI chips dedicated to low-power AI inferencing captured one of the largest rounds of February. The startup, Recogni, already offers a low-power vision inferencing chip. Several other sizeable rounds were focused on the automotive space, with robotaxis, autonomous delivery, and the sensors that enable them. Another active area, power electronics drew funding for several c... » read more

Next Generation Highly Power-Efficient AI Accelerator (DRP-AI3)

By Renesas - 06 Mar, 2024 - Comments: 0

As the working population decreases due to falling birthrates and a growing proportion of the population being elderly, advanced artificial intelligence (AI) processing, such as recognition of the surrounding environment, decision of actions, and motion control, will be required in various aspects of society, including factories, logistics, medical care, service robots operating in the city, an... » read more

Optimized Drivetrain And New Semiconductor Technologies Enable The Design Of Energy-Efficient Electric Vehicles

By Infineon - 06 Mar, 2024 - Comments: 0

The traction inverter is the core component of the drivetrain in all-electric vehicles, making it the most essential system: The device plays a crucial role in enabling efficient and sustainable electromobility since it directly influences the power output and significantly affects the vehicle’s dynamics. However, to develop efficient electric vehicles the integration of complementary sub... » read more

Ensure Zero Functional CDC Signoff Defects With VC SpyGlass Integrated Solution

By Synopsys - 06 Mar, 2024 - Comments: 0

This whitepaper will explain how designers can ensure zero defects seamlessly using Synopsys VC SpyGlass as a single cockpit for not just structural CDC analysis but also for complete functional analysis. We will also cover how designers can utilize a single dashboard for tracking the functional CDC signoff progress over the course of the project. Click here to read more. » read more

HBM3E And GDDR6: Memory Solutions For AI

By Rambus - 06 Mar, 2024 - Comments: 0

AI/ML changes everything, impacting every industry and touching the lives of everyone. With AI training sets growing at a pace of 10X per year, memory bandwidth is a critical area of focus as we move into the next era of computing and enable this continued growth. AI training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM3E and G... » read more

Large-Scale Quantum-Processing Architecture Surpassing The Tier of 1000 Atomic Qubits (TU Darmstadt)

By Technical Paper Link - 05 Mar, 2024 - Comments: 0

A technical paper titled “Supercharged two-dimensional tweezer array with more than 1000 atomic qubits” was published by researchers at Technische Universität Darmstadt (TU Darmstadt). Abstract: "We report on the realization of a large-scale quantum-processing architecture surpassing the tier of 1000 atomic qubits. By tiling multiple microlens-generated tweezer arrays, each operated by a... » read more

An Analytical EM Model For IC Shielding Against HW Attacks

By Technical Paper Link - 05 Mar, 2024 - Comments: 0

A technical paper titled “Refined Analytical EM Model of IC-Internal Shielding for Hardware-Security and Intra-Device Simulative Framework” was published by researchers at Bar-Ilan University and Rafael Defense Systems. Abstract: "Over the past two decades, the prominence of physical attacks on electronic devices, designed to extract confidential information, has surged. These attacks exp... » read more

Lowering The Computational Cost of Simulation (DOE, Princeton)

By Technical Paper Link - 05 Mar, 2024 - Comments: 0

A technical paper titled “Accuracy of the explicit energy-conserving particle-in-cell method for under-resolved simulations of capacitively coupled plasma discharges” was published by researchers at Princeton University. Abstract: "The traditional explicit electrostatic momentum-conserving particle-in-cell algorithm requires strict resolution of the electron Debye length to deliver numeri... » read more

A Hypermultiplexed Integrated Tensor Optical Processor (USC, MIT et al.)

By Technical Paper Link - 05 Mar, 2024 - Comments: 0

A technical paper titled “Hypermultiplexed Integrated Tensor Optical Processor” was published by researchers at the University of Southern California, Massachusetts Institute of Technology (MIT), City University of Hong Kong, and NTT Research. Abstract: "The escalating data volume and complexity resulting from the rapid expansion of artificial intelligence (AI), internet of things (IoT) a... » read more