Micro FPGAs And Embedded FPGAs


When people hear “FPGA” they think “big, expensive, power hungry.”  But it doesn’t need to be that way. Renesas has announced their Forge FPGA family. Details are at their website and in one of the many articles that covered their press release. Forge FPGAs show that FPGAs don’t have to be big, power hungry, and expensive. Forge FPGAs are tiny, draw standby current measure... » read more

Intelligent Traceability For ISO 26262


Requirements driven development is a foundational component of any safety critical lifecycle, including ISO 26262, the state-of-the-art standard guiding safety in the development of automotive electronic devices. At face value, requirements seem like a very straight forward concept. Project teams write requirements. Requirements are implemented into the product. The product is tested... » read more

Startup Funding: January 2023


Quantum computing had a good month in January, collectively raising over $240 million. A significant chunk of that went to a full-stack quantum company whose processers use neutral atoms manipulated by optical tweezers. Other companies funded this month are developing trapped ion processors, photonics-based processors, and quantum memories, which will be essential for quantum networking. Two co... » read more

Forgotten Essence Of The Backend Penetration Testing


At Riscure we have observed many severe security issues exploited by hackers even in previously certified solutions. In recent years, certification, which aims to minimize security risks, has become more important, especially in the mobile application industry. However, certification compliance is sometimes still not sufficient. This is especially noticeable when the solution’s functionality ... » read more

Blog Review: Feb. 1


Siemens EDA's Harry Foster explores trends in low power design techniques for ICs and ASICs, with 72% of design projects reported actively managing power. Synopsys' Charlie Matar, Rita Horner, and Pawini Mahajan look at the concept of reliability, availability, and serviceability (RAS) in the context of high-performance computing SoC designs and how it can be supported with silicon lifecycle... » read more

Countering The Threat From Quantum Computers


Quantum computers hold much promise for the future, yet their computing power poses a significant threat to current security methods such as public key cryptography. In this white paper, Infineon will examine this issue in detail, propose an approach for future security based on TPMs and discuss current TPM technology. The reader can expect to gain a good appreciation of the security issues sur... » read more

Chip Industry Startup Funding Annual Report & Analysis: 2022


Introduction New ideas fuel the semiconductor industry, and money enables those ideas. Tracking what startups get funded is one way to see which ideas are more viable and which problems need to be solved most urgently. In general, the more startups working on a solution to a particular problem, the greater the need for a viable solution — and the more likely one will be developed. Investo... » read more

Improving PPA When Embedding FPGAs Into SoCs


Embedded FPGAs have been on everyone’s radar for years as a way of extending the life of chips developed at advanced nodes, but they typically have come with high performance and power overhead. That’s no longer the case, and the ability to control complex chips and keep them current with changes to algorithms and various protocols is significant step. Geoff Tate, CEO of Flex Logix, talks a... » read more

Chip Industry’s Technical Paper Roundup: Jan. 31


New technical papers added to Semiconductor Engineering’s library. [table id=77 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting l... » read more

Research Bits: Jan. 31


The power of proximity Researchers from Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab), Stanford, and University of California Berkeley have observed that electrons transfer heat rapidly between layers of the 2D semiconductor materials tungsten diselenide (WSe2) and tungsten disulfide (WS2). The electrons acted as a bridge between the two materials, the layers of... » read more

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