Expediting Manufacturing Safe Launch With Big Data AI/ML Analytic Solutions On The Cloud
By PDF Solutions - 06 Aug, 2024 - Comments: 0

With highly competitive time-to-market and time-to-volume windows, IC suppliers need to be able to release new product to production (NPI) in a timely manner with competitive manufacturing metrics. Manufacturing yield, test time and quality are important metrics in NPI to Manufacturing safe launch. A powerful yield management system is crucial to achieve the goal metrics. In this paper, recomme... » read more

Real-World Applications Of Computational Fluid Dynamics
By Ed Sperling - 05 Aug, 2024 - Comments: 0

More powerful chips are enabling chips to process more data faster, but they're also having a revolutionary impact on how that data can be used. Simulations that used to take days or weeks now can be completed in a matter of hours, and multi-physics simulations that were implausible to even consider are now very much in the realm of what is possible. Parviz Moin, professor of mechanical enginee... » read more

Research Bits: Aug. 5
By Jesse Allen - 05 Aug, 2024 - Comments: 0

Measuring temperature with neutrons Researchers from Osaka University, National Institutes for Quantum Science and Technology, Hokkaido University, Japan Atomic Energy Agency, and Tokamak Energy developed a way to rapidly measure the temperature of electronic components inside a device using neutrons. The technique, called ‘neutron resonance absorption’ (NRA), examines neutrons being ab... » read more

Ensure Reliability In Automotive ICs By Reducing Thermal Effects
By Lee Wang - 05 Aug, 2024 - Comments: 0

In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D assembly offers numerous benefits, including enhanced performance, reduced power consumption, and more efficient use of space. However, this advanced technology also introduces significant thermal di... » read more

Flexible-Wafer Platform And CMOS-Compatible 300mm Wafer-Scale Integrated-Photonics Fabrication
By Technical Paper Link - 03 Aug, 2024 - Comments: 0

A new technical paper titled "Mechanically-flexible wafer-scale integrated-photonics fabrication platform" was published by researchers at MIT and New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES). Abstract "The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabric... » read more

Chip Industry Week in Review
By The SE Staff - 02 Aug, 2024 - Comments: 0

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Heterogeneity Of 3DICs As A Security Vulnerability
By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "Harnessing Heterogeneity for Targeted Attacks on 3-D ICs" was published by Drexel University. Abstract "As 3-D integrated circuits (ICs) increasingly pervade the microelectronics industry, the integration of heterogeneous components presents a unique challenge from a security perspective. To this end, an attack on a victim die of a multi-tiered heterogeneous 3-... » read more

A Hybrid ECO Detailed Placement Flow for Mitigating Dynamic IR Drop (UC San Diego)
By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "A Hybrid ECO Detailed Placement Flow for Improved Reduction of Dynamic IR Drop" was published by researchers at UC San Diego. Abstract: "With advanced semiconductor technology progressing well into sub-7nm scale, voltage drop has become an increasingly challenging issue. As a result, there has been extensive research focused on predicting and mitigating dynam... » read more

Classification and Localization of Semiconductor Defect Classes in Aggressive Pitches (imec, Screen)
By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection" was published by Imec and SCREEN SPE Germany. Abstract "Deep learning-based semiconductor defect inspection has gained traction in recent years, offering a powerful and versatile approach that provides high accuracy, adaptability, and efficiency in detecting and classifying... » read more

Survey of Energy Efficient PIM Processors
By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "Survey of Deep Learning Accelerators for Edge and Emerging Computing" was published by researchers at University of Dayton and the Air Force Research Laboratory. Abstract "The unprecedented progress in artificial intelligence (AI), particularly in deep learning algorithms with ubiquitous internet connected smart devices, has created a high demand for AI compu... » read more

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