An Integrated Workflow For Circuit Design, Simulation, And Functional Safety Analysis


By Daniel Zhang and Claudius Jordan Functional safety analysis is a crucial step in the development of safety-critical systems. It ensures that the system-under-development meets its defined safety requirements and functions safely under both nominal and fault conditions. In the event of a failure, the system must respond appropriately to mitigate the risk of safety hazards that could potent... » read more

Verifying Scale-Up And Scale-Out In Data Centers


Semiconductor Engineering sat down to discuss challenges and solutions for data center build-out and build-up with Gordon Allan, Siemens EDA director of verification IP; Rishi Chugh, vice president of product marketing for network switching at Marvell; Saravanan Kalinagasamy, senior director of ASIC design and validation at Astera Labs; and Jalaj Gupta, product engineering lead at Siemens EDA. ... » read more

Data Center Digital Twins: How Simulation Improves Design And Performance


Data center digital twins are transforming data center design from assumption-based planning to physics-backed simulation—well before the first rack is deployed. By combining physics simulations with real operational data, a data center digital twin enables teams to predict performance, reduce risk, and optimize capacity with measurable confidence. As power densities rise from AI and hype... » read more

40 PCB Design Tips Every Designer Should Know: eBook


This eBook details 40 essential PCB design tips, organized by 5 sections: Project Planning, Requirements, and Documentation Placement, Floorplanning, and Mechanical Integration Power, Grounding and Thermal Signal Integrity and High-Speed Routing Manufacturability, Test and Reliability Read more here.   » read more

Back-End Automation Tackles Growing Complexity


Experts at the table: Semiconductor Engineering sat down to discuss back-end automation challenges in advanced packaging with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. What follows are ex... » read more

What Designers Need to Know About UALink for Scalable AI Systems


As AI workloads rapidly scale, interconnect performance, latency, and memory access become critical bottlenecks. This white paper explores how the UALink protocol enables high-speed, low-latency, and secure GPU-to-GPU communication, unlocking scalable AI architectures beyond traditional limits. Key Takeaways: Learn how UALink enables efficient GPU memory pooling at scale Understand U... » read more

Blog Review: Feb. 25


Cadence's Mick Posner introduces the Foundational Chiplet System Architecture, a specification that aims to deliver a vendor and CPU-neutral architecture, common system partition guidelines, and a shared vocabulary and set of standards for system-level and interface definitions between chiplets. Synopsys' Scott Knowlton explains why LPDDR6 represents a big step forward in memory management c... » read more

Purpose-Built Tools for Connected Design


Modern semiconductor design is a massive, data-driven effort—often involving terabytes of files and globally distributed teams. Yet many organizations still rely on disconnected workflows and generic version control tools not designed for the scale or complexity of chip development. These fragmented systems slow innovation, reduce efficiency, and make collaboration increasingly difficult. ... » read more

Survey of DL-Based LiDAR Super-Resolution For Autonomous Driving (University College London)


University College London researchers published "A Comprehensive Survey on Deep Learning-Based LiDAR Super-Resolution for Autonomous Driving." Abstract "LiDAR sensors are often considered essential for autonomous driving, but high-resolution sensors remain expensive while affordable low-resolution sensors produce sparse point clouds that miss critical details. LiDAR super-resolution addre... » read more

Three New ALD/MLD Processes for Co-organic Thin Films (Aalto University, RUB et al.)


A new technical paper, "Amido-Amine Co(II) Precursor-Based Atomic/Molecular Layer Deposition Processes for Cobalt-Organic Thin Films and Their Thermal Conversion to CoO Thin Films," was published by researchers at Aalto University, Ruhr University Bochum, Tyndall National Institute, ESRF et al. "Atomic/molecular layer deposition (ALD/MLD) offers a comprehensive process and application portfo... » read more

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