Electrical Model of the Bitflip in SRAM Under Laser Illumination Simulating Laser Fault Injection


A new technical paper, "Electrical modelisation of a bitflip in SRAM cell memory induced by laser fault injection," was published by researchers at Univ Rennes, CNRS, IETR. Abstract "An electrical model of the bitflip in SRAM under laser illumination simulating laser fault injection is proposed. This model is based on a bipolar phototransistor responsible of the amplified induced photocur... » read more

Nanoscale MoS₂-based Memristors Integrated into CMOS Microchips


A new technical paper, "Integration of Low-Voltage Nanoscale MoS2 Memristors on CMOS Microchips" was published by RWTH Aachen and Forschungszentrum Jülich GmbH. Abstract "2D materials (2DMs) are gaining increased attention for applications such as advanced electronics and neuromorphic computing due to their excellent electrical properties. Among these 2DMs, molybdenum disulfide (MoS2) ha... » read more

Chip Industry Week in Review


The IEEE ISSCC conference was held this week in San Francisco. Among the highlights: IBM detailed an AI accelerator based on its new inferencing dataflow architecture. CEA-Leti presented a chip-scale, ultra-fast, battery-operated EPR spectrometer. QuTech introduced a cryo-CMOS SoC with NV centers in diamond. UTokyo showed its low-jitter PLL architecture for beyond 5G/6G. Imec d... » read more

The On-Device LLM Revolution


The AI world is experiencing a fundamental shift. After years of cloud-centric inference dominated by massive data center GPUs, we're witnessing an accelerating migration of language models to edge devices. These are not the trillion-parameter behemoths that require server farms, but the "Goldilocks zone" models: 3B to 30B parameters — large enough to deliver genuinely useful AI capabilities,... » read more

Automotive Week In Review


Quick links: Deals and New Chips, Batteries and BEVs, Autonomous, Policy and Research. Deals and New Chips Infineon and BMW are jointly developing software-defined vehicles based on BMW’s “Neue Klasse” architecture and Infineon’s MCUs, high-speed Ethernet solutions, power management ICs, and power switches. Tata Electronics will manufacture Qualcomm's automotive modules in I... » read more

Redefining Backside Metallization: Low‑Temperature Solutions For HDFO And S‑SWIFT Designs


As chip performance and integration continue to advance, thermal dissipation control has become increasingly critical not only at the wafer fabrication level but also in the packaging industry. For artificial intelligence (AI) and high performance computing (HPC) applications, the industry is gradually shifting toward 2.5D integration. In response to the growing demand, High-Density Fan-Out (HD... » read more

Understanding Within-Wafer Variations: A Virtual Fabrication Approach


One of the unavoidable aspects of chip manufacturing is that some dies on a wafer perform differently than others, even though they were made together on the same wafer. This blog dives into that mystery and provides a way to predict and fix these issues. Imagine baking cookies. If your oven has hot and cold spots, some cookies will be perfect; others burnt. That’s what happens in chip man... » read more

Force Fields Will Accelerate Atomistic Simulations By 10,000× In 2026, Unlocking New Era Of Discovery


By Anders Blom and Igor Markov “Force fields” have long captured our imagination — the invisible shields of science-fiction lore that protect starships and superheroes from harm. But in the world of scientific discovery, force fields play a much different role: They are mathematical models that let us peer into the atomic heart of matter itself. Now, thanks to breakthroughs in artif... » read more

Laser Arrays May Simplify Co-Packaged Optics


Key Takeaways Moving photonic ICs into the same package as silicon helps improve performance, but lasers remain outside. A new monolithic laser array allows hundreds of colors, each individually software-tunable New options are being turned into products, which could help commercialize CPO. The move to co-packaged optics (CPO) holds the promise of putting photonic ICs (PICs)... » read more

Leading At Light Speed: What Makes Photonics Leadership Different


By Jan-Bart Smits and David Harap Every time a transistor switches, it generates heat. Pack enough transistors together and you hit a wall: the chip melts before it computes. This thermal ceiling is why Splunk notes that "as physical and economic limitations are reached, the pace predicted by Moore's Law is slowing." Light solves this problem. Photons carry information without generating ... » read more

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