2D materials for future heterogeneous electronics
By Technical Paper Link - 16 Mar, 2022 - Comments: 0

Abstract "Graphene and two-dimensional materials (2DM) remain an active field of research in science and engineering over 15 years after the first reports of 2DM. The vast amount of available data and the high performance of device demonstrators leave little doubt about the potential of 2DM for applications in electronics, photonics and sensing. So where are the integrated chips and enabled ... » read more

What Else Can You Do While Driving A Car?
By Ann Mutschler - 16 Mar, 2022 - Comments: 0

Increasing levels of autonomy in vehicles are driving increased demands for new technology. Consumers care about the electronics in their vehicles, for both safety and convenience, and those features are impacting both purchase decisions and new vehicle designs. As vehicles grow in sophistication with advanced driver assistance, electrification, or alternative fuel sources, personalized vehi... » read more

Blog Review: March 16
By Jesse Allen - 16 Mar, 2022 - Comments: 0

Ansys' Peter Hallschmid and Sandra Gely look at why, compared to rain and fog, snow is a different challenging environment for automotive sensors and how the random pattern of snowfall, properties of each flake, and the various distance between flakes play havoc on detecting objects. Siemens' Chuck Battikha focuses on how to protect against random hardware faults, the added costs of includin... » read more

Survey: 2022 Deep Learning Applications
By eBeam Initiative - 16 Mar, 2022 - Comments: 0

The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Site-To-Site Variation In Parallel Test
By Ed Seng - 16 Mar, 2022 - Comments: 0

From wafer to system level test, parallel test execution delivers significant benefits, including reduced costs, yet it’s never as simple as that PowerPoint slide you present to management. An engineering effort is required to balance the thermo-electrical challenges that occur as you increase the number of sites to be tested, or the number of slots in a burn-in oven or system level te... » read more

Vertical MoS2 transistors with sub-1-nm gate lengths
By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract "Ultra-scaled transistors are of interest in the development of next-generation electronic devices. Although atomically thin molybdenum disulfide (MoS2) transistors have been reported, the fabrication of devices with gate lengths below 1 nm has been challenging. Here we demonstrate side-wall MoS2 transistors with an atomically thin channel and a physical gate length of sub-1 nm ... » read more

Large-area photonic lift-off process for flexible thin-film transistors
By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract "Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the plastic substrate from a carrier without damaging the electronics remains challenging. Here we utilize a large-area, high-throughput photonic lift-off (PLO) process to rapidly separate polymer f... » read more

An achromatic X-ray lens
By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract "Diffractive and refractive optical elements have become an integral part of most high-resolution X-ray microscopes. However, they suffer from inherent chromatic aberration. This has to date restricted their use to narrow-bandwidth radiation, essentially limiting such high-resolution X-ray microscopes to high-brightness synchrotron sources. Similar to visible light optics, one way t... » read more

NAND and NOR logic-in-memory comprising silicon nanowire feedback field-effect transistors
By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract: "The processing of large amounts of data requires a high energy efficiency and fast processing time for high-performance computing systems. However, conventional von Neumann computing systems have performance limitations because of bottlenecks in data movement between separated processing and memory hierarchy, which causes latency and high power consumption. To overcome this hindra... » read more

Enhanced on-chip phase measurement by inverse weak value amplification
By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract: "Optical interferometry plays an essential role in precision metrology such as in gravitational wave detection, gyroscopes, and environmental sensing. Weak value amplification enables reaching the shot-noise-limit of sensitivity, which is difficult for most optical sensors, by amplifying the interferometric signal without amplifying certain technical noises. We implement a generali... » read more

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