HDCP 2.3: Enabling Robust Security Of High-Res Displays
By Dana Neustadter - 03 Feb, 2022 - Comments: 0

Displays, monitors and touchscreens are the interface to our digital lives everywhere—at home, at work, and in the car. Display designers continuously upgrade their products with higher bandwidth, new technologies, and innovative features. New, modular products incorporate micro LEDs to allow new form factors, such as designing displays that are as thin as a canvas, can be rolled up, or can b... » read more

eFPGA Saved Us Millions of Dollars. It Can Do the Same for You
By Andy Jaros - 03 Feb, 2022 - Comments: 0

For those of you who follow Flex Logix, you already know that we have an IP business, EFLX eFGPA, and an edge inferencing co-processor chip and board business, InferX. InferX came about because we had many customers ask if they can run AI/ML algorithms in EFLX. The answer was and still is, of course you can – EFLX is an FPGA fabric similar to what FPGA chips use. Our co-founder, Cheng Wang, t... » read more

Ensuring Functional Safety For Automotive AI Processors
By Frank Schirrmeister - 03 Feb, 2022 - Comments: 0

Safety is critically important across the automotive, industrial, and aerospace and defense industries. For instance, Cadence's work with Hailo illustrates how advances in semiconductor technology and EDA deliver safe electronics without compromising low power and cost. Hailo's automotive webpage starts with the words "The pursuit for 'vision zero,'" reflecting that European road fatalitie... » read more

Addressing Library Characterization And Verification Challenges Using ML
By Siemens EDA - 02 Feb, 2022 - Comments: 0

At advanced process nodes, Liberty or library (.lib) requirements are more demanding due to design complexities, increased number of corners required for timing signoff, and the need for statistical variation modeling. This results in an increase in size, complexity, and the number of .lib characterizations. Validation and verification of these complex and large .lib files is a challenging task... » read more

Data Center Evolution: The Leap To 64 GT/s Signaling With PCI Express 6.0
By Rambus - 02 Feb, 2022 - Comments: 0

The PCI Express (PCIe) interface is the critical backbone that moves data at high bandwidth and low latency between various compute nodes such as CPUs, GPUs, FPGAs, and workload-specific accelerators. With the torrid rise in bandwidth demands of advanced workloads such as AI/ML training, PCIe 6.0 jumps signaling to 64 GT/s with some of the biggest changes yet in the standard. Download this w... » read more

Augment Or Replace? How IAST Fits Into The AppSec Landscape
By Synopsys - 02 Feb, 2022 - Comments: 0

As the pace, volume, and complexity of application development continue to escalate, it becomes increasingly difficult to maintain software security and quality. More speed, more volume, and more complexity too often lead to less security and less quality. Interactive application security testing (IAST) is an exciting option for organizations looking to maintain both the speed and complexity... » read more

Startup Funding: January 2022
By Jesse Allen - 02 Feb, 2022 - Comments: 0

China's startups are the star of the month once again, with more companies based or co-headquartered in the country receiving funding in January 2022 than the rest of the world combined. Exact investment figures for Chinese startups are frequently not reported, but based on minimum amounts given, they raised more than the rest of the world as well. The largest round of the month went to a co... » read more

Blog Review: Feb. 2
By Jesse Allen - 02 Feb, 2022 - Comments: 0

Synopsys' Stelios Diamantidis shares some predictions for AI in 2022, including the three markets that will push new AI chips, the increasing need for trust chains, the entry of non-traditional companies, and the impact of AI in chip design. Siemens EDA's Ray Salemi checks out how Python and SystemVerilog can work together to boost the verification ecosystem by taking advantage of what each ... » read more

Innovative Top-Side Cooled Package Solution For High-Voltage Applications
By Infineon - 02 Feb, 2022 - Comments: 0

This application note shows the benefits of using top-side cooled (TSC) power devices in high-voltage (HV) applications. In addition, it should help designers of such applications to understand how the device can be used and how an efficient and easy-to-assemble approach can be chosen to integrate TSC devices into the system. This application note describes Infineon’s new heat-spreader dual s... » read more

Manufacturing Bits: Feb. 1
By Mark LaPedus - 01 Feb, 2022 - Comments: 0

Fab equipment cybersecurity In a major step to help provide security in the semiconductor manufacturing supply chain, SEMI has published the first cybersecurity specifications and standards for fab equipment. For some time, the semiconductor industry has been developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP... » read more

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