Manufacturing Bits: Jan. 25
By Mark LaPedus - 25 Jan, 2022 - Comments: 0

Stretchable thermometers The Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) has developed a stretchable and self-powered thermometer that can be integrated into various systems, such as stretchable electronics and soft robots. Depending on the materials used, the stretchable thermometer can measure temperatures of more than 200 degrees Celsius to -100 degrees Cel... » read more

Photomask Challenges At 3nm And Beyond
By Mark LaPedus - 25 Jan, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

Power/Performance Bits: Jan. 25
By Jesse Allen - 25 Jan, 2022 - Comments: 0

Nanoscale 3D optics Researchers at Rice University and University of Houston are using 3D printing to build nanostructures of silica for micro-scale electronic, mechanical, and photonic devices. “It’s very tough to make complicated, three-dimensional geometries with traditional photolithography techniques,” said Jun Lou, a professor of materials science and nanoengineering at Rice. �... » read more

Health Care Is Gold Mine For Hackers
By John Koon - 24 Jan, 2022 - Comments: 0

Today’s digital health care systems are facing relentless cyberattacks, which are targeting health care organizations as well as the medical devices they use. The critical nature and size of the U.S. health care market — an estimated $3.5 trillion in 2020, with substantial growth anticipated — make it a favorite target of hackers. Vanson Bourne conducted a survey for Sophos in early 20... » read more

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems
By Technical Paper Link - 21 Jan, 2022 - Comments: 0

Abstract: "Companies working on semiconductors must currently assure the customers of not only the performance of the semiconductor device per se, but also its performance when it is implemented in a real board, therefore including the role of parasitic effects. It is therefore very important to evaluate, especially during the design phase, not only the single device, but the complete board ... » read more

X-ray Imaging of Silicon Die Within Fully Packaged Semiconductor Devices
By Technical Paper Link - 21 Jan, 2022 - Comments: 0

Abstract: "X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Analog Devices AD9253 die initially falls, but after 100 °C, it rises again. The twist across the die wafer falls linearly with an incre... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Jan, 2022 - Comments: 0

Fabs Intel has announced plans for an initial investment of more than $20 billion in the construction of two new leading-edge fabs in Ohio. Planning for the first two factories will start immediately, with construction expected to begin late in 2022. Production is expected to come online in 2025. As part of the announcement, Air Products, Applied Materials, Lam Research and Ultra Clean Technol... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jan, 2022 - Comments: 0

Tools & design EDA industry revenue increased 7.1% year-over-year from $2.95 billion to $3.46 billion in Q3 2021, according to the ESD Alliance. "Geographically, all regions reported double-digit growth, with product categories CAE, Printed Circuit Board and Multi-Chip Module, SIP, and Services also showing double-digit growth," said Walden C. Rhines, Executive Sponsor of the SEMI Electron... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 Jan, 2022 - Comments: 0

Security Arm shipped a prototype CHERI-enabled Morello processor, SoC, and board, the first products coming from the security Morello research program that aims to make more secure hardware that will block certain common attacks. The first board prototypes are going to testing teams at Google, Microsoft, and other major stakeholders and partners across the industry and academia.  The UKRI (UK... » read more

Screen Printed Chipless RFID Tags on Packaging Substrates
By Technical Paper Link - 20 Jan, 2022 - Comments: 0

Abstract: "A chipless radio frequency identification (RFID) tag is a suitable low-cost alternative to any chip-based RFID one. The flexibility to use low-cost printing techniques makes chipless RFID a competitive technology. In this paper, we report an evaluation of the microwave performance of two different screen-printed chipless tags in the 3–6 GHz range. The tags were designed and scre... » read more

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