Supply Chain Security And Counterfeit Detection Using UCT
By proteanTecs - 11 Jan, 2022 - Comments: 0

The recent shortage of chip supply and long lead times prompted system makers to turn to second tier suppliers and distributors for fulfilling their semiconductor needs. This in turn has put the spotlight on the growing concern of fraudulent or counterfeited integrated circuits (ICs). Proteus deep data analytics based on Universal Chip Telemetry (UCT) provides a new approach to supply chain ... » read more

Over-The-Air (OTA) Test Socket And Handler Integration Technology For 5G Mass Production Testing
By Advantest - 11 Jan, 2022 - Comments: 0

This paper presents the integration of socket, measurement antenna and handler for over-the-air (OTA) testing of antenna-in-package (AiP) devices using automated test equipment (ATE) for 5G applications. The design and characteristics of sockets for performing OTA testing in the radiating near field are also discussed. The paper also describes the structure of OTA handler integration using thes... » read more

Inspecting And Testing GaN Power Semis
By Patrick Waurzyniak - 11 Jan, 2022 - Comments: 1

As demand for new automotive battery electric vehicles (BEVs) heats up, automakers are looking for solutions to meet strict zero-defect goals in power semiconductors. Gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap power semiconductors offer automakers a range of new EV solutions, but questions remain on how to meet the stringent quality goals of the automotive industry. Among t... » read more

Extreme Ancestry: Silicon Edition
By Mike McIntyre - 11 Jan, 2022 - Comments: 0

The ability to trace the genealogy of all the components in an electronic device has been getting more complex for decades. For many industries — automotive, defense, medical and others — the need to locate the source of a problem in near real-time is paramount to gauging the extent of that problem. The extreme case is when the issue occurs with a product that already has been distributed a... » read more

Large-Field, Fine-Resolution Lithography Enables Next-Generation Panel-Level Packaging
By Onto Innovation - 11 Jan, 2022 - Comments: 0

The lithography challenge for large heterogeneous integration is the limited size of the exposure field (typically 60mm x 60mm or less) for most currently available lithography systems. Fine resolution and a large field size provide the user with the opportunity to increase the package size beyond 150mm x 150mm and maintain high throughput. This new capability has the potential to pave the ... » read more

Multi-Layer Attack Graph Analysis in the 5G Edge Network Using a Dynamic Hexagonal Fuzzy Method
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "Overall, 5G networks are expected to become the backbone of many critical IT applications. With 5G, new tech advancements and innovation are expected; 5G currently operates on software-defined networking. This enables 5G to implement network slicing to meet the unique requirements of every application. As a result, 5G is more flexible and scalable than 4G LTE and previous generations... » read more

Evaluation of Thermal Imaging on Embedded GPU Platforms for Application in Vehicular Assistance Systems
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "This study is focused on evaluating the real-time performance of thermal object detection for smart and safe vehicular systems by deploying the trained networks on GPU & single-board EDGE-GPU computing platforms for onboard automotive sensor suite testing. A novel large-scale thermal dataset comprising of > 35,000 distinct frames is acquired, processed, and open-sourced in challengin... » read more

Energy-efficient Non Uniform Last Level Caches for Chip-multiprocessors Based on Compression
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "With technology scaling, the size of cache systems in chip-multiprocessors (CMPs) has been dramatically increased to efficiently store and manipulate a large amount of data in future applications and decrease the gap between cores and off-chip memory accesses. For future CMPs architecting, 3D stacking of LLCs has been recently introduced as a new methodology to combat to performance ... » read more

Adaptive Scheduling for Time-Triggered Network-on-Chip-Based Multi-Core Architecture Using Genetic Algorithm
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "Adaptation in time-triggered systems can be motivated by energy efficiency, fault recovery, and changing environmental conditions. Adaptation in time-triggered systems is achieved by preserving temporal predictability through metascheduling techniques. Nevertheless, utilising existing metascheduling schemes for time-triggered network-on-chip architectures poses design time computatio... » read more

Fabrication of GaN/Diamond Heterointerface and Interfacial Chemical Bonding State for Highly Efficient Device Design
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "The direct integration of gallium nitride (GaN) and diamond holds much promise for high-power devices. However, it is a big challenge to grow GaN on diamond due to the large lattice and thermal-expansion coefficient mismatch between GaN and diamond. In this work, the fabrication of a GaN/diamond heterointerface is successfully achieved by a surface activated bonding (SAB) method at r... » read more

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