Novel Reversible Chain Diagnosis Improves Resolution


Yield ramp for ICs designed on advanced process technologies faces new challenges because of the very complicated silicon defect types and defect distribution. Yield ramp and yield improvement are not just about profitability and time-to-market, but also have a role in today’s electronics supply chain crisis. That means yield ramp affects not just the IC maker, but the global economy. Ever... » read more

Automotive Keyless Entry SoC Test Methodologies And Techniques


By Philip Brock, Louis Benton, Jr., and Jonvyn Wongso Passive Entry Passive Start (PEPS) technology has become standard in the automotive market for keyless operation. A secure wireless communication system, PEPS enables you to lock and unlock the vehicle, and start and stop the vehicle without physically using the key. Electronic functionality embedded in the key fob to interact with the ve... » read more

Expanding Silicon Lifecycle Management To Real-Time System Performance Optimization


Semiconductor development is currently in one of its periodic crises, with many factors combining to require dramatically new technologies and methodologies. Chips continue to grow ever larger and more complex, with 3D IC devices adding another layer of challenges. Huge data centers, autonomous vehicles, and algorithms using artificial intelligence (AI) and machine learning (ML) drive a relentl... » read more

Industrial Radiography — CT Scanning for Metrology Applications


Xray technology, more specifically computed tomography (CT), has been adapted for use as an instrument of industrial metrology. Early adopters have quickly recognized the benefits of internal and external nondestructive testing for 3D defect detection and geometric analysis, while those considering adoption may be uncertain how to implement the technology effectively. This study was conducted t... » read more

Imaging Of Overlay And Alignment Markers Under Opaque Layers Using Picosecond Laser Acoustic Measurements


Optically opaque materials present a series of challenges for alignment and overlay in the semi-damascene process flow or after the processing of the magnetic tunnel junction (MTJ) of a Magnetic Random-Access Memory (MRAM). The overlay and alignment of a lithographically defined pattern on top of the pattern and the underlying layer is fundamental to device operation in all multi-layer patterne... » read more

VLSI Design Careers


If you're planning your career in the semiconductor industry, make sure you consider processor design. Now the aspiring VLSI engineers like you can implement the open-source processor RISC-V while learning from the textbooks. But why should a VLSI engineer understand the processor design? Does everyone implement the processor as an RTL designer? In this article, I will address these question... » read more

Manufacturing Bits: Nov. 8


Plasma R&D with quantum computing Rigetti Computing, a developer of quantum computers, has been selected to lead a quantum simulation project for the development of fusion energy. The project was awarded by the Department of Energy (DoE). Under the plan, Rigetti will collaborate with Lawrence Livermore National Laboratory and the University of Southern California on a three-year, $3.1 m... » read more

Power/Performance Bits: Nov. 8


Molecular memristor Researchers from National University of Singapore, Indian Association for the Cultivation of Science, University of Limerick, Texas A&M University, and Hewlett Packard Enterprise discovered a molecular memristor for brain-inspired computing. The molecule uses natural asymmetry in its metal-organic bonds to switch between different states, which allows it to perform u... » read more

Solving Real World AI Productization Challenges With Adaptive Computing


The field of artificial intelligence (AI) moves swiftly, with the pace of innovation only accelerating. While the software industry has been successful in deploying AI in production, the hardware industry – including automotive, industrial, and smart retail – is still in its infancy in terms of AI productization. Major gaps still exist that hinder AI algorithm proof-of-concepts (PoC) from b... » read more

Week In Review: Manufacturing, Test


Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more

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