Redesigning Core and Cache Hierarchy For A General-Purpose Monolithic 3D System
By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A technical paper titled "RevaMp3D: Architecting the Processor Core and Cache Hierarchy for Systems with Monolithically-Integrated Logic and Memory" was published by researchers at ETH Zürich, KMUTNB, NTUA, and University of Toronto. Abstract: "Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip with fine-graine... » read more

Wearable Electrotactile Rendering System w/High Spacial resolution, Rapid Refresh
By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A new technical paper titled "Super-resolution wearable electrotactile rendering system" was published by researchers at City University of Hong Kong (CityU) and Tencent Technology's Robotics X Laboratory. "Here, we present a wearable electrotactile rendering system that elicits tactile stimuli with both high spatial resolution (76 dots/cm2) and rapid refresh rates (4 kHz), because of a prev... » read more

Chip Challenges In The Metaverse
By Ed Sperling - 24 Oct, 2022 - Comments: 0

The metaverse is pushing the limits of chip design, despite uncertainty about how much raw horsepower these devices ultimately will require to deliver an immersive blend of augmented, virtual, and mixed reality. The big challenge in developing these systems is the ability to process mixed data types in real time while the data moves uninterrupted at lightning speed. That requires the integra... » read more

Optimizing Vmin With Path Margin Monitors
By Ash Patel - 24 Oct, 2022 - Comments: 0

By Firooz Massoudi and Ash Patel Choosing the right operating voltage for various digital blocks within a semiconductor device is one of the most important tasks faced by chip designers. Operating voltage has major effects on performance, power consumption, and reliability. Increasing the voltage generally increases performance, but at the cost of more power and higher lifetime operating cos... » read more

Hardware Trojan Inserted Inside A RISC-V Based Automotive Telematics Control Unit
By Technical Paper Link - 21 Oct, 2022 - Comments: 0

A new technical paper titled "On the Feasibility of Remotely Triggered Automotive Hardware Trojans" was written by researchers at Georgia Tech. "In this paper, we discuss how Hardware Trojans can act as the physical access intermediates to allow the remote triggering of malicious payloads embedded in ECUs, through seemingly benign wireless communication. We demonstrate a proof of concept ECU... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 21 Oct, 2022 - Comments: 0

Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 Oct, 2022 - Comments: 0

Automotive, mobility The BMW Group will invest $1.7 billion in its U.S. operations to build electric vehicles and batteries, mostly in South Carolina. BMW will drop $1 billion in its South Carolina plant for EV production and $700 million for a new battery-assembly facility in the state. BMW also agreed to purchase battery cells from Japan-based Envision AESC, which plans to construct a new ba... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 21 Oct, 2022 - Comments: 0

Tools and IP Electronic system design revenue hit a record $3.75 billion in the second quarter, according to a report from ESD Alliance, a SEMI Technology Community. That number represents a 17.5% year-over-year increase. Walden C. Rhines, the report’s executive sponsor, said it was the largest such jump in over a decade and that all product categories and geographic regions recorded second ... » read more

SiPs: The Best Things in Small Packages
By Laura Peters - 20 Oct, 2022 - Comments: 0

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and processes. SiP is an essential packaging platform that integrates multiple functionalities onto a single substrate, which enables lower system cost, design flexibility, and superior electrical p... » read more

Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures
By Adele Hars - 20 Oct, 2022 - Comments: 0

Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these new 3D structures — some on the horizon but some already in high-volume manufacturing — semiconductor wafer equipment and materials suppliers in the wet cleaning business are at the epicenter... » read more

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