Which Foundry Is In The Lead? It Depends.

By Ed Sperling - 26 Oct, 2022 - Comments: 2

The multi-billion-dollar race for foundry leadership is becoming more convoluted and complex, making it difficult to determine which company is in the lead at any time because there are so many factors that need to be weighed. This largely is a reflection of changes in the customer base at the leading edge and the push toward domain-specific designs. In the past, companies like Apple, Google... » read more

Faster And Smarter LVS For The SoC Era

By Synopsys - 26 Oct, 2022 - Comments: 0

Development of a modern system-on-chip (SoC) device is a long and incredibly complex process. Design teams rely on a huge range of tools, technologies, and methodologies to get the job done. Given the ongoing advances in silicon technology and design architecture, the tools are in a constant state of evolution. Logic-versus-schematic (LVS) checking is one of those tools. This is one of the earl... » read more

E-Mobility: Navigate Safety, Interoperability, And Conformance

By Keysight - 26 Oct, 2022 - Comments: 0

Although the concept of electric vehicles (EV) has been around for a while, the EV and EV supply equipment (EVSE) markets are not well-regulated or fully operational. This presents several challenges for EV and EVSE manufacturers throughout the e-mobility ecosystem. Safety, interoperability, and conformance are important criteria for enabling e-mobility, and Keysight is ready to help. Read this... » read more

AI As A Service For Signal Processing

By Renesas - 26 Oct, 2022 - Comments: 0

Reality Analytics provides AI tools, optimized for solving problems related to sensors and signals. Working with acceleration, vibration, sound, electrical, RF, and proprietary signal sets, Reality Analytics tools identify signatures of real-world events or conditions in sensor and signal data, and create software that can then spot those signals in the wild, notifying applications and devices ... » read more

Blog Review: Oct. 26

By Jesse Allen - 26 Oct, 2022 - Comments: 0

Synopsys' Teng-Kiat Lee and Sandeep Mehndiratta argue that IC design in the cloud can support an existing on-prem strategy, enable large and small enterprises to manage cost and capacity more effectively, and offer security for valuable semiconductor IP. Siemens EDA's Chris Spear finds that SystemVerilog classes are a good way to encapsulate both variables and the routines that operates on t... » read more

Securing Accelerator Blades For Datacenter AI/ML Workloads

By Emma-Jane Crozier - 25 Oct, 2022 - Comments: 0

Data centers handle huge amounts of AI/ML training and inference workloads for their individual customers. Such a vast number of workloads calls for efficient processing, and to handle these workloads we have seen many new solutions emerge in the market. One of these solutions is pluggable accelerator blades, often deployed in massively parallel arrays, that implement the latest state-of-the-ar... » read more

Testing 2.5D And 3D-ICs

By Ed Sperling - 25 Oct, 2022 - Comments: 0

Disaggregating SoCs allows chipmakers to cram more features and functions into a package than can fit on a reticle-sized chip. But as Vidya Neerkundar, technical marketing engineer at Siemens EDA explains, there are challenges in accessing all of the dies or chiplets in a package. The new IEEE 1838 standard addresses that, as well as what to do when 2.5D and 3D-ICs are combined together in the ... » read more

Research Bits: Oct. 25

By Jesse Allen - 25 Oct, 2022 - Comments: 0

Polarization for photonic processor Researchers from the University of Oxford and University of Exeter developed a photonic processor that uses multiple polarization channels, increasing information density. "We all know that the advantage of photonics over electronics is that light is faster and more functional over large bandwidths. So, our aim was to fully harness such advantages of phot... » read more

Chip Industry’s Technical Paper Roundup: Oct 25

By Linda Christensen - 25 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Active Learning to Reduce Data Requirements For Defect Identification in Semiconductor Manufacturing

By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A new technical paper titled "Exploring Active Learning for Semiconductor Defect Segmentation" was published by researchers at Agency for Science, Technology and Research (A*STAR) in Singapore. "We identify two unique challenges when applying AL on semiconductor XRM scans: large domain shift and severe class-imbalance. To address these challenges, we propose to perform contrastive pretrainin... » read more

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