Gearing Up For High-NA EUV
By Mark LaPedus - 21 Oct, 2021 - Comments: 2

The semiconductor industry is moving full speed ahead to develop high-NA EUV, but bringing up this next generation lithography system and the associated infrastructure remains a monumental and expensive task. ASML has been developing its high-numerical aperture (high-NA) EUV lithography line for some time. Basically, high-NA EUV scanners are the follow-on to today’s EUV lithography systems... » read more

A Look Inside The Apple iPhone 13 Pro
By Stacy Wegner - 21 Oct, 2021 - Comments: 0

By Stacy Wegner, Daniel Yang, and Ziad Shukry We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below. The phone models we are discussing today are the Apple iPhone 13 Pro, model A2636, 256GB and the Apple iPhone 13, model A2631 256GB. Apple iPhone 13 Pro cost analysis We have completed the QTT cost analysis and estimate ... » read more

Progress On General-Purpose Quantum Computers
By Katherine Derbyshire - 21 Oct, 2021 - Comments: 0

The race is on to scale up quantum computing, transforming it from an esoteric research tool into a commercially viable, general-purpose machine. Special-purpose quantum computers have been available for several years now. Systems like D-Wave’s Advantage focus on specific classes of problems that are amenable to modeling as quantum systems. Still, the ultimate goal of having a general purp... » read more

Four Types Of Predictive Maintenance Technologies
By Jessica Albright - 21 Oct, 2021 - Comments: 0

Through the expansion of our Smart Devices and Printed Electronics Foundry, we have assisted a diverse range of customers to find the benefits of predictive maintenance to improve the efficiency of their production, the safety of their personnel, and the quality of their products. We have identified some of the most prevalent predictive maintenance technologies and some of the most common appl... » read more

What’s Next For Transistors And Chiplets
By Mark LaPedus - 21 Oct, 2021 - Comments: 5

Sri Samavedam, senior vice president of CMOS Technologies at Imec, sat down with Semiconductor Engineering to talk about finFET scaling, gate-all-around transistors, interconnects, packaging, chiplets and 3D SoCs. What follows are excerpts of that discussion. SE: The semiconductor technology roadmap is moving in several different directions. We have traditional logic scaling, but packaging i... » read more

High Thermal Die-Attach Paste Development For Analog Devices
By Amkor - 20 Oct, 2021 - Comments: 0

Authors: Kiichiro Higaki, Toru Takahashi, Akinori Ono from Assembly Engineering Department Amkor Technology Japan, Inc. Keiichi Kusaka, Takayuki Nishi, Takeshi Mori from Information & Telecommunication Materials Research Laboratory, Sumitomo Bakelite Company, Limited Daisuke Koike, Masahiko Hori from Package Solution Technology Development Department, Electronic Devices & Storage Res... » read more

Blog Review: Oct. 20
By Jesse Allen - 20 Oct, 2021 - Comments: 0

Siemens EDA's Sumit Vishwakarma promotes ironing out preliminary bugs by using a real number model to describe an analog block as a discrete floating-point model and enable it to simulate in a digital solver at near-digital simulation speeds. Synopsys' Taylor Armerding explains how including security in the software development process from the beginning planning stages onward will help IoT ... » read more

Improving Accuracy In Satellite Navigation Systems
By Bryon Moyer - 20 Oct, 2021 - Comments: 0

Increasing dependency on the global navigation satellite system (GNSS) constellations is raising concerns about what happens when signals are unavailable, even for short periods of time. GNSS systems affect our daily lives in ways we often don’t see, from location services to cell phone timing. In fact, these satellites have become a necessary part of critical infrastructure, and higher ac... » read more

Reaching silicon-based NEMS performances with 3D printed nanomechanical resonators
By Technical Paper Link - 19 Oct, 2021 - Comments: 0

Abstract: "The extreme miniaturization in NEMS resonators offers the possibility to reach an unprecedented resolution in high-performance mass sensing. These very low limits of detection are related to the combination of two factors: a small resonator mass and a high quality factor. The main drawback of NEMS is represented by the highly complex, multi-steps, and expensive fabrication process... » read more

Effect Of Environmental Factors On ADAS Sensor Performance (AAA)
By Technical Paper Link - 19 Oct, 2021 - Comments: 0

Abstract "Advanced driver assistance systems (ADAS) are becoming increasingly integrated within new vehicles sold in the United States. However, the majority of publicly available performance evaluations occur within idealized operation conditions in terms of weather, time of day, and sensor status, which are typically unrepresentative of naturalistic environments.  To evaluate the performa... » read more

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