category: Blogs – MD

category: IoT, Security & Automotive

Industry 4.0: The Smart Industrial Revolution
By Shelly Miyasato - 20 Sep, 2018 - Comments: 0

As consumers, we see evidence of the Internet of Things (IoT) all around us. A growing number of everyday objects in our homes and cars are now digitally connected in a way that allows us to interact with them. Even mundane items such as keychains and wallets can be made smart with trackers and mobile device apps. A similar revolution is occurring in some workplaces, with the growing ability to... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science
By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

A Review of Silicon Photonics
By Michael Hargrove - 20 Aug, 2018 - Comments: 0

With the end of Moore’s Law rapidly approaching—some say it's already here—new applications of older technologies are gaining attention. One specific area of interest is photonics. The National Center for Optics and Photonic Education defines photonics as the technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. It can also be... » read more

Memory Startups To Watch
By Mark LaPedus - 16 Aug, 2018 - Comments: 0

The next-generation memories are finally ramping up after years’ of delays and promises. Intel, for one, is shipping 3D XPoint, a next-generation technology based on phase-change memory. In addition, the big foundries are readying embedded MRAM. And, of course, there are a number of other players in the next-generation memory arena. There are also a number of startups that are flying un... » read more

Optimizing 5G With AI At The Edge
By Peter Rabbeni - 16 Aug, 2018 - Comments: 0

AI touches our lives in many different ways, and while some AI-enabled applications are highly visible, like the increasingly popular Amazon Echo and Google Home voice-controlled intelligent digital assistants, others are less obvious. But by no means are they less important. For example, AI techniques are essential to the successful rollout of 5G wireless communications. 5G is the develop... » read more

Automotive Electronics: Driving The Semiconductor Market
By Jim Feldhan - 16 Aug, 2018 - Comments: 0

Automotive electronics is the fastest growing end application in the semiconductor market, but what systems will see the highest penetration rates? Currently, self-driving cars grab much of the media attention, and for good reason. Semico estimates that today’s self-driving car has $21,525 of additional electronics. However, recent tests of ADAS vehicles produced less than stellar results. II... » read more

Semiconductors In Automotive
By Kris Kendall - 16 Aug, 2018 - Comments: 1

It was more than 130 years ago in 1885 when Gottlieb Daimler invented the first prototype for the modern gas engine, and in 1886 Karl Benz patented his three-wheel Benz Motor Car, Model No. 1. Yet even these visionaries might have been surprised by the sophisticated technology running our cars today – and they couldn’t even have imagined the vast range of semiconductor components involved. ... » read more

Growth Ahead For Vacuum Subsystems
By Julian West - 16 Aug, 2018 - Comments: 0

Vacuum pumps, pressure gauges and vacuum valves combined make up the biggest expense on the bill of materials for semiconductor OEMs. In 2017, almost $2.5 billion worth of vacuum subsystems were consumed by the semiconductor industry with over half supplied by vendors based in Europe. Vacuum subsystems sales account for one third of expenditure on all critical subsystems used in semiconducto... » read more

The Materials Side Of AI
By Jonathan Bakke - 16 Aug, 2018 - Comments: 0

As we enter the foundry 7nm and below technology nodes, tungsten fill for contacts has reached the physical limits of scaling and copper used in the lowest level interconnects is facing challenges on multiple fronts. Solving these issues will require a new conducting material, namely cobalt. This transition can enable continued device scaling and less power consumption per computation. Follo... » read more

The Next Generation Of Fingerprinting Technology
By Yongqing Jiang - 06 Aug, 2018 - Comments: 0

We used to think of fingerprinting as simply placing your finger on an ink pad and then rolling it on paper to obtain an identifiable mark that would distinguish you from everyone else on the planet. In today’s world, fingerprinting has evolved to take on another, broader definition. According to dictionary.com, fingerprinting can also mean “any unique or distinctive pattern that presents u... » read more

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