category: Blogs – MD

category: IoT, Security & Automotive

System-In-Package Vs. eNVM
By Yafeng Zhang - 21 Jun, 2018 - Comments: 0

The booming automotive and IoT markets are driving increasing demand for microcontrollers (MCUs). Recent forecasts project that the overall MCU compound annual growth rate (CAGR) will reach 4% over the next five years, and in particular the automotive MCU CAGR could reach close to 14%. Non-volatile memory (NVM) is a critical element of MCUs, as it is needed not only to store the code, but al... » read more

Combining Human Intelligence And Smart Machines
By SEMI - 21 Jun, 2018 - Comments: 1

By Nancy Greco, Dave Mayewski, James Moyne, Paul Werbaneth The spacecraft Discovery and its HAL 9000 computer system had a digital twin. Stanley Kubrick’s seminal film “2001: A Space Odyssey” had its theatrical release 50 years ago this April. “2001” isn’t just a great science fiction film. Rather, it’s a great work of cinema overall, across any category. (The American Film... » read more

Can AI Alter The Burgeoning Design Cost Trend?
By Rich Wawrzyniak - 21 Jun, 2018 - Comments: 0

Everyone in the semiconductor design arena has experienced or at least observed the impact of increasing costs for complex SoC silicon. Semico’s recently released report entitled "Silicon and Software Design Cost Analysis" reveals the cost associated with a first time design effort for a high-end, advanced performance multicore SoC using 7nm process technology can top $195M for both the silic... » read more

Delivering On The Promise Of Self-Driving Cars
By Stephen Breit - 13 Jun, 2018 - Comments: 1

Self-driving cars have been all the rage in both the trade and popular press in recent years. I prefer the term “autonomous vehicles,” which more broadly captures the possibilities, encompassing not only small passenger vehicles but mass transit and industrial vehicles as well. Depending on who’s talking, we will all be riding in fully autonomous vehicles in five to 25 years. The five-... » read more

Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers
By Kim Yess - 11 Jun, 2018 - Comments: 0

Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for itself in the next generation of ultrathin wafer manufacturing. Semiconductor wafers are being forced to become thinner as the push to shrink feature sizes and introduce full-scale 3D integration ... » read more

What’s In A Node?
By Sundeep Bajikar - 30 May, 2018 - Comments: 0

In an environment where process nodes are no longer consistently delivering the level of improvements predicted by Moore’s Law, the industry will continue to develop “inter-nodes” as a way to deliver incremental improvements in lieu of “full-nodes.” A shift in market requirements, in part due to the rise of AI and IoT, is increasing emphasis on trailing-nodes. When it comes to leading... » read more

Transistor-Level Performance Evaluation Based On Wafer-Level Process Modeling
By Michael Hargrove - 30 May, 2018 - Comments: 0

Three years ago, I wrote a blog entitled “Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation,” in which I described the seamless connection between the SEMulator3D virtual wafer fabrication software platform and external third-party TCAD software. I’m now happy to report that device-level I-V performance analysis is now a built-in module within the SEMulator3D so... » read more

What’s Missing In EUV?
By Mark LaPedus - 17 May, 2018 - Comments: 0

Extreme ultraviolet (EUV) lithography is expected to move into production at 7nm and/or 5nm, but as previously reported, there are some gaps in the arena. At one time, the power source was the big problem, but that appears to be solved in the near term. Now, a phenomenon called stochastic effects, or random variations, are the biggest challenge for EUV lithography. But at most events, th... » read more

The Challenges Of Process Control On FinFETs And FD-SOI
By Jeff Barnum - 17 May, 2018 - Comments: 0

Across the semiconductor industry, both FD-SOI and finFET transistor technologies are in high volume production, with IC manufacturers looking to extend both technologies to gain additional performance improvements and meet the variety of customer specific technical and economic requirements. In developing the processes needed for the next-generation FD-SOI and finFET technologies, both transis... » read more

How 5G Differs From Previous Network Technologies
By Gary Dagastine - 17 May, 2018 - Comments: 0

The Mobile World Congress in Barcelona, Spain is the wireless industry’s leading annual event, and this year’s edition in late February was buzzing with talk of 5G wireless technology and its evolving uses and technology requirements. First, Gregg Bartlett and Dr. Bami Bastani, Sr. Vice Presidents of GlobalFoundries' CMOS and RF business units, respectively, outlined 5G-related semico... » read more

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