category: Blogs – MD

category: IoT, Security & Automotive

Resetting Expectations On Multi-Patterning Decomposition And Checking
By David Abercrombie - 17 Dec, 2015 - Comments: 0

As I said in Part 1 of this topic, it never ceases to amaze me how much confusion and misunderstanding there is when it comes to multi-patterning (MP) decomposition and checking. That entire first article only focused on the typical subjects I’ve had to discuss with customers regarding double-patterning (DP). I have to tell you that with the deployment of triple-patterning (TP) and quadruple-... » read more

Case Study: A CEO’s Journey And Learning In M&A
By Jonathan Davis - 17 Dec, 2015 - Comments: 0

Executives at this year’s SEMI International Technology Partners Conference (ITPC) assessed a number of forces currently shaping the semiconductor industry, including such topics as Internet of Things (IoT) investment, mounting technology complexity, the ascent of China, and pervasive industry consolidation. Participants particularly valued ITPC as a thought-leadership platform for sharing st... » read more

Inside The SRC
By Mark LaPedus - 17 Dec, 2015 - Comments: 0

Semiconductor Engineering sat down to talk with Ken Hansen, the new president and chief executive of the Semiconductor Research Corp. (SRC), a U.S.-based technology research consortium. Prior to joining the SRC in May, Hansen was vice president and chief technology officer at Freescale. What follows are excerpts of that conversation. SE: My impression is that the SRC allocates funding for va... » read more

The Urge To Merge
By Jonathan Davis - 14 Dec, 2015 - Comments: 0

The electronics supply chain will remember 2015 as a year of unprecedented consolidation due to relentless acquisition activity, mega mergers and a rampant restructuring of the industry. Almost every other week brought a momentous announcement. Seemingly, before one could appreciate the current status, the industry reverberated with yet another new deal. To better understand the scope of M&A... » read more

MEMS: Flexible, Reusable Platforms Facilitate Innovation
By Paula Doe - 07 Dec, 2015 - Comments: 0

As the game-changing enabler for whatever the emerging market of widespread fragmented intelligence turns out to look like, the MEMS sector is in some ways the bellwether for much of the greater semiconductor/components supply chain looking to rethink how to serve a wider range of fragmented applications with lower costs and faster time to market. Leaders from Cisco, InvenSense, Nasiri Ventures... » read more

Healthy Growth Predictions For MEMS
By Paula Doe - 30 Nov, 2015 - Comments: 0

To figure out what’s actually happening in the emerging Internet of Things (IoT) market, there’s no better place to look than MEMS and sensors, which are enabling this revolution in embedded intelligence in ever more places. The MEMS market is seeing continued steady growth, but components suppliers also are seeing brutal price declines and low margins, while the data analysis side captures... » read more

You’re Not Alone
By Srinivas Velivala - 19 Nov, 2015 - Comments: 0

All too often we get caught up in our own work and our own issues, thinking no one else could possibly be having as much trouble as we are. The reality is that many, if not most, of the problems and challenges in IC verification are not unique to one design, one team, or one person. The natural reluctance of people to admit they are struggling with some aspect of their job often keeps them from... » read more

Packaging Wars Ahead
By Ed Sperling - 19 Nov, 2015 - Comments: 0

There has been much talk about semiconductor industry consolidation, but the shift into advanced packaging could have more far-reaching effects than all the mega-deals so far. Packaging is big business. Yole Développement has pinned the market at $30 billion, but that's only a thin slice of the pie that's in play. Companies that win the packaging deals also have a good shot of winning the m... » read more

Inside X-ray Metrology
By Mark LaPedus - 19 Nov, 2015 - Comments: 0

Chipmakers are ramping up a new class of chip architectures, such as 3D NAND and finFETs. Measuring and characterizing the tiny structures in these technologies is a major challenge. It will not only take the traditional metrology tools, but also various X-ray techniques. To get a handle on X-ray metrology, Semiconductor Engineering recently discussed the trends with the following experts: ... » read more

The Growing Role Of Extended Supply Chain Collaboration
By Karen Savala - 19 Nov, 2015 - Comments: 0

At the executive keynote panel held at Semicon West 2015, one of the key industry challenges discussed was the growing need for closer collaboration between supply chain partners in order to support the fast time to market and shortened product lifecycles of today’s consumer electronics. Traditionally, the yield ramp phase has been a critical time to resolve manufacturing issues, enable high ... » read more

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