category: Blogs – MD

category: IoT, Security & Automotive

Another Inventory Glut?
By Jim Feldhan - 16 Oct, 2014 - Comments: 0

For nearly a year, Semico’s IPI index has been indicating that the fundamental demand in the second half of 2014 would be seasonally weak. Back in early 2013, our initial view for 2014 was a 10% market growth. However, as the IPI declined in the second half of 2013 we revised our semiconductor revenue forecast down to 7.3% heeding the warning that was projected by the Semico IPI index. This w... » read more

Custom Print For Multi-Column Inspection
By eBeam Initiative - 16 Oct, 2014 - Comments: 0

By Tony Luo What are the challenges in optical inspection? Let's take a closer look. Click on the video below to find out. [youtube vid=vzFSyHwD_AU] —Tony Luo is the founder of Singapore-based Maglen. » read more

How Chip Vendors Counter Security Vulnerabilities In The IoT
By Tony Massimini - 18 Sep, 2014 - Comments: 0

The objective of the Internet of Things is connectivity and interoperability of many connected devices. There is a large amount of data that is being generated. This data is transmitted from end devices, the “things,” through a network of gateways, routers, smartphones, PCs and other devices up to the cloud into vast databases. Many sources of little data develop into Big Data. Information ... » read more

Materials Matter
By SEMI - 18 Sep, 2014 - Comments: 0

By Pushkar Apte Despite formidable technical and economic challenges, the semiconductor technology engine continues steaming ahead, changing the way we work and play in amazing ways. This engine primarily ran on the “Moore’s Law track” for nearly half a century – but now, the tracks are diverging for digital logic and memory, and “More-than-Moore” devices. Continuing progress requi... » read more

How To Buy Used Fab Tools
By Mark LaPedus - 18 Sep, 2014 - Comments: 0

Buying used equipment is a good way to find viable tools at reasonable prices. But the used equipment market is not a simple place to shop for good deals. As reported in this article, it’s a complex market. For example, buyers of fab tools can procure used gear from several sources—an OEM; a used equipment company; a broker; and through eBay. Some IDMs also sell used equipment. So what a... » read more

The Route To Faster Physical Verification And Better Designs
By Jean-Marie Brunet - 18 Sep, 2014 - Comments: 0

By Nancy Nguyen & Jean-Marie Brunet As we’ve moved to today’s leading-edge nodes, physical layout designers have faced more and more challenges to get their design to tape-out on schedule. Timing becomes increasingly difficult to converge, power reduction for both IR and leakage becomes a big issue, and most importantly, how do we meet all of the ever-growing and more complex signoff d... » read more

This Is What 450mm Wafers Look Like
By SEMI - 14 Aug, 2014 - Comments: 0

The first fully patterned 450mm wafers were on display at SEMICON West 2014 in South Hall and also showcased in the 450mm Technology Development Session. Fully patterned 450mm wafers produced using Molecular Imprints’ Imprio nanoimprint lithography (NIL) tool have been shown before (including at SEMI ISS meeting in January 2013). However, the 450mm wafers on display at SEMICON West were produ... » read more

Self-Aligned Double Patterning—Part Deux
By David Abercrombie - 14 Aug, 2014 - Comments: 0

In my last article, I introduced you to the basic Self-Aligned Double-Patterning (SADP) process that is one of the potential candidate techniques for processing metal layers at 10nm and below, but let’s have a quick recap. SADP uses a deposition and etch step process to create spacers surrounding a patterned shape (Figure 1). As you can see, there are two masking steps—the first mask is cal... » read more

Plotting IBM Micro’s Future
By Mark LaPedus - 14 Aug, 2014 - Comments: 1

It’s been a wild ride for IBM’s Microelectronics Group. Neither IBM, nor the other parties involved, have made any public comments about the recent events concerning IBM Micro. Much of the drama has played out in the media. Based on those reports, here’s a rough outline of the events. Not long ago, IBM put its loss-ridden chip unit on the block to shore up the company’s bottom lin... » read more

FinFET Ramp: Changing Market Dynamics?
By Joanne Itow - 14 Aug, 2014 - Comments: 1

Rolling out a new semiconductor technology always has its share of challenges, but it seems like the 14nm finFET process node is starting off with more than its share of delays and speculation. This week Intel revealed some of the details for its new microarchitecture, Broadwell, and their first product, the Intel Core M processor, to be manufactured using their second-generation finFET, 14... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy