category: Blogs – MD

category: IoT, Security & Automotive

A Milestone In Imprint Lithography
By Michael Watts - 20 Feb, 2014 - Comments: 0

The announcement on Feb. 13 of the acquisition of the semiconductor arm of Molecular Imprints (MII) by Canon is a seminal event in the story of imprint patterning. Full disclosure requires me to mention that as a founding team member at Molecular Imprints, my founders shares are now worth something — but well short of not needing to write a free blog as a marketing exercise for my consulting ... » read more

Driving Innovation: From Talk to Action
By Karen Savala - 20 Feb, 2014 - Comments: 0

During the recent SEMI Industry Strategy Symposium, one of the themes focused on the challenges of building an innovative workforce with fresh ideas. KLA CEO and president Rick Wallace’s opening keynote address included an appeal for industry to actively recruit more young talent to foster greater levels of innovative thinking. He said that only four percent of the U.S. workforce is compos... » read more

New Rules For DRAM
By Jim Feldhan - 20 Feb, 2014 - Comments: 0

By Jim Feldhan DRAM revenues grew by more than 30% in 2013. Average selling prices increased more than 45% as capacity constraints especially for LPDRAM, motivated the transition from 2GB density parts up to 4GB DRAM units declined by almost 10%. Revenue growth rates of more than 30% combined with a declining unit base are not new to the memory market. But 2013 was a pivotal year for DRAM. ... » read more

Does It Take A Catastrophe?
By Linda Prowse Fosler - 20 Feb, 2014 - Comments: 0

What makes a company search for new verification methods and tools? Sometimes organizations change, proactively, because they are wise and want to avoid problems; but sadly, more often it is a catastrophe that forces change. This was the case with a large U.S. supplier of safety-critical and high-reliability ICs. After a failed chip, it finally moved from simply verifying the analog and digi... » read more

Lithography-Enabled Scaling Challenges
By Ehud Tzuri - 20 Feb, 2014 - Comments: 0

The semiconductor industry is being challenged as never before when it comes to lithography-enabled scaling. While development of new patterning techniques and resists as well as inspection and metrology capabilities have helped device scaling advance, major issues continue to challenge the future of Moore’s Law. There’s an industry shift from lithography-enabled 2D devices to materials-ena... » read more

Looking Beyond Moore’s Law
By Mark LaPedus - 20 Feb, 2014 - Comments: 2

For decades, chip scaling has followed a simple linear curve. In this curve, the transistor gate-pitch scales at 0.7x every two years. This is the driving force behind Moore’s Law, which states that the number of transistors per chip roughly doubles every two years. But starting at the 16nm/14nm node, there is a change taking place in chip scaling. According to a chart from Imec, there are... » read more

IMEC’s 30th Anniversary: A Consortium With Impact
By Michael Watts - 01 Feb, 2014 - Comments: 0

In the history of semiconductor technology, one of the critical non-technology changes was the point when the biggest companies realized that they could not afford to do all the basic R&D. They agreed to collaborate in “pre-competitive” phase development through consortia such as IMEC and Sematech. IMEC is celebrating its 30th anniversary, and it’s interesting to recognize the signifi... » read more

Printed Electronics Gets Serious About Manufacturing
By Michael Watts - 23 Jan, 2014 - Comments: 0

A leading indicator in the coming-of-age saga of a new technology is the enthusiasm to be in the business of supplying manufacturing infrastructure. To sell infrastructure, there needs to be a belief that there are several customers out there. At the recent IDTech conference for printed electronics, the transition to manufacturing was clear based on those who presented and some notable absences... » read more

The Trouble With Triples—Part 2
By David Abercrombie - 23 Jan, 2014 - Comments: 1

In my last blog, we started to look at some of the challenges of triple patterning (TP) compared to double patterning (DP). In particular, we looked at the algorithmic complexity of determining if a valid coloring solution exists, and if so, producing a three-mask decomposition. This time, let’s look into the challenges of what to do if a layout is not legally decomposable into three colors. ... » read more

Beyond The CES Hype
By Joanne Itow - 23 Jan, 2014 - Comments: 0

Now that the dust has settled, it’s time to realistically assess all the activity at CES 2014. The big screen TVs, the shiny new cars and all the excitement over Internet of Things certainly dazzled the CES show floor. But how much of it is hype and what will really become sustainable products? Smart lighting, smart refrigerators, smart cars, and a smart thermostat are all part of what is... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy