category: Blogs – MD

category: IoT, Security & Automotive

Semiconductor New Equipment Market $32.0 Billion For 2013
By Lara Chamness - 12 Dec, 2013 - Comments: 0

Orders for new equipment slowly improved early on in 2013, with bookings reaching a peak by the second quarter before receding in the third quarter. Over this time, equipment billings, while increasing, were trending below 2012 levels. In October, book-to-bill data from both SEMI and the SEAJ show bookings are increasing once again, and this indicates a stronger fourth quarter for the semico... » read more

Defective R&D Funding Models
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

For years, the semiconductor equipment industry has been dealing with an R&D funding gap. Here’s the basic problem: Chipmakers demand certain tools for their next-generation processes, but they are not always willing to foot a large percentage of the R&D bill. And so, the equipment vendors develop the tools and assume a large part of R&D funding--and the risks. Fair or unf... » read more

3D NAND Is A Reality – What’s Next?
By Gill Lee - 02 Dec, 2013 - Comments: 0

One of the biggest developments taking place in the semiconductor industry is the emergence of 3D NAND memory technology. Products are available today that feature 3D NAND devices. It has taken years to become a reality — since Toshiba first discussed the concept of 3D NAND at the VLSI Symposium in 2007 – and now it is poised to replace planar NAND flash memory for storage. The path that... » read more

The Next Dimension
By Ed Sperling - 14 Nov, 2013 - Comments: 0

It’s hard to say definitively whether this is a trend or an aberration, but after what appears to have been a slam-dunk sprint to the finish line with finFETs some companies are re-evaluating their alternatives based upon return on investment. In place of perpetually shrinking features—and looming multipatterning at the next node—there is renewed interest in staying at 28nm with FDSOI,... » read more

IP Ecosystem Solutions For Complex Systems
By Joanne Itow - 14 Nov, 2013 - Comments: 0

At the Semico Impact Conference: Focus on the IP Ecosystem, Mahesh Tirupattur, Executive Vice President, Analog Bits, challenged four panelists to an engaging discussion on their approach to IP Ecosystem Solutions for Complex Systems. Panel participants included Dan Kochpatcharin, Deputy Director, IP Portfolio Management, TSMC; Jason Polychronopoulos, Mentor Graphics; Chris Rowen, Cadence Fello... » read more

3D-IC Standardization Progress Continues
By James Amano - 14 Nov, 2013 - Comments: 1

Since its formation in December 2010, the SEMI 3DS-IC Standards Committee has made significant progress in establishing key standards in areas such as TSV metrology, glass carrier wafers, and terminology. The committee’s two newest standards are SEMI 3D6-0913 - Guide for Chemical Mechanical Planarization (CMP) and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration, and S... » read more

The Trouble With Triples—Part 1
By David Abercrombie - 14 Nov, 2013 - Comments: 0

If you’re a true geek like me, you may remember the Star Trek episode “The Trouble with Tribbles,” about the cute furry little aliens that purr when you pet them. They seemed so nice and friendly on the surface, but in the end, they became an exponentially growing mass of ravenous monsters that almost broke down the ship and consumed the storehouse of grain that was meant to provide human... » read more

More 3D Printing Applications
By Michael Watts - 14 Nov, 2013 - Comments: 0

There is enough news about 3D printing that the Guardian newspaper’s Web site even has a special section on it. The list of demonstrated applications runs the gamut from guns to panties via custom bobble head dolls and organs. It's interesting to look at all these ideas and try and work out which really has potential. There are 3 categories for potential: Practical. Possible with inv... » read more

Crunch Time
By Brian Fuller - 14 Nov, 2013 - Comments: 0

The electronics industry finds itself today at a tipping point (well, okay, another tipping point). Consider:  The network as we’ve known it for a couple of generations is changing before our eyes, not the least of which to accommodate the expected explosion of Internet of Things in the coming years. ARM CEO Simon Segars put it this way at the recent ARM TechCon event in Santa Clara: ... » read more

ARMing Intel
By Mark LaPedus - 14 Nov, 2013 - Comments: 0

For some time, the industry has kept a close eye on Intel’s fledging foundry business. The question is whether Intel will merely dabble in the foundry business or become a major player. The answer? It’s still too early to tell. Not long ago, Intel entered the foundry business and announced a smattering of small and niche-oriented customers, such as Achronix, Netronome and Tabula.  Micro... » read more

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