category: Blogs – MD

category: IoT, Security & Automotive

Breakthroughs Required
By Ed Sperling - 21 Mar, 2013 - Comments: 0

Linear progressions have a hypnotic effect on even the smartest people. They lull everyone into thinking that progress—or at least a progression—is a straight line, with little or no recognition that things are changing around the edges. The periphery is definitely changing, though. And over the next couple of process nodes, the semiconductor manufacturing industry either will have to fi... » read more

More Photons Are Good
By Michael Watts - 20 Mar, 2013 - Comments: 0

By Michael P.C. Watts Scatterometry is the favored approach to monitor complex 3D nano-structures in production. At SPIE Advanced Lithography, KLA introduced a new generation of their scatterometry metrology system. The new system expands the number of different measurements; know internally as multi-multi-multi. Scatterometry relies on measuring the diffraction patterns from a test diffr... » read more

Directed Self Assembly, double patterning and crying in beer
By Michael Watts - 20 Mar, 2013 - Comments: 1

In the creative, or desperate, rush to find ways to pattern 10 nm node using double patterning immersion 193nm lithography, a designer from ARM is left “crying in his beer” at the consequent design difficulties. This heart rending admission was one of many insights that came at the sessions on Directed Self Assembly (DSA) at Advanced Lithography. Double Patterning has become the -we have... » read more

What’s In A Name?
By Subi Kengeri - 20 Mar, 2013 - Comments: 0

By Subi Kengeri Consumers continue to demand smaller, faster and more energy-efficient electronic devices, driving the semiconductor industry to accelerate development of commercially viable chips on more advanced nodes. However, these new nodes don’t just appear by magic. It takes a great deal of careful planning to develop and deliver a process technology platform that offers competitivene... » read more

Over 50% Of Smart Phones And Tablets Leverage SOI
By Various Writers - 18 Mar, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ In a recent press release, the SOI wafer leader Soitec said that chips built on its SOI wafers were found in over half of the smartphones and tablets in the market worldwide. 50%? That’s a lot! How do they figure that? The answer: RF. [caption id="attachment_809" align="alignleft" width="549" caption="As seen here... » read more

Cymer’s EUV Team Has An Exciting Few Months
By Michael Watts - 14 Mar, 2013 - Comments: 0

By Michael P.C. Watts At SPIE Advanced Lithography, Cymer announced some serious progress in EUV source development, one of several highlights. The latest results provided 40W of power in runs over 8 hours that mimicked full productions conditions including dose control. As far as I can tell, 40w translates to around 30 - 300 mm wafers an hour. The Cymer source uses a CO2 laser with 3 ampli... » read more

SEMICON West: Accelerating R&D
By Karen Savala - 11 Mar, 2013 - Comments: 0

By Karen Savala Earlier this month, SEMI announced the addition of the Silicon Innovation Forum (SIF) to SEMICON West to help accelerate the innovation pipeline for advanced semiconductor technology. This exciting program was developed in collaboration with leading strategic investment groups in our industry, including Applied Ventures, Dow Chemical Company, Intel Capital, Micron Ventures, TE... » read more

Extreme sources, block copolymers, and resist polishing at SPIE Advanced Lithography.
By Michael Watts - 04 Mar, 2013 - Comments: 0

by Michael P.C. Watts Lots to talk about from SPIE Advance Lithography Conference this year; EUV power, multi-beam systems, double patterning, and imprint. I thought I would pick up some highlights here, and then come back and talk about them in detail over the next few weeks. One of the extreme sources was the paper from Cymer/ASML on EUV sources . Their paper showed performance, at prod... » read more

SPIE Advanced Lithography 2013 – day 4
By Chris Mack - 03 Mar, 2013 - Comments: 0

The final day of the Advanced Lithography Symposium contains what is commonly referred to as the “tool” sessions, where tool makers give updates on their latest and greatest products.  As such it tends to have the most commercial presentations, with all the problems that come with commercial pressures.  For the EUV conference it is also the day where technology cheerleading, and skepticis... » read more

SPIE Advanced Lithography 2013 – day 3
By Chris Mack - 28 Feb, 2013 - Comments: 0

Wednesday was, for me, a busy day since I had two talks to give.  The first was the opening keynote talk at the Design for Manufacturability (DFM) conference entitled “The future of lithography and its impact on design”.  The take-home message was that lithography would become less critical to the success of the industry, and that materials, device architecture, and design would be the ke... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy