category: Blogs – SLD

category: IoT, Security & Automotive

Multi-Die Packaging Gains Steam
By Si2 - 06 Oct, 2014 - Comments: 0

By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more

‘Hardening’ SoCs For Automotive Market Challenges
By Kurt Shuler - 26 Sep, 2014 - Comments: 0

The semiconductor is enamored with the automotive, industrial and medical markets, and many companies are now shifting their focus there. But many mainstream vendors will face challenges entering this market. For those who have traditionally participated in the smart phone or mobility market, I will outline some changes they need to consider to successfully compete in these emerging spaces. ... » read more

Evaluation Platforms Key To Complex IP Integration
By Swamy Irrinki - 25 Sep, 2014 - Comments: 0

Just because a chip is complex to build doesn’t mean it has to take a long time. Runaway complexity in SoC and ASIC design is forcing chip companies to consider different methodologies and approaches that could actually simplify and speed up the whole process. The first step in this process was commercial IP, and its growing popularity attests to the fact that chipmakers are looking for... » read more

New Tools Enabling The Internet of Things
By Frank Schirrmeister - 25 Sep, 2014 - Comments: 0

Last week I attended CDNLive Boston as a speaker and was really looking forward to the keynote given by Samuel H. Fuller, CTO and VP of R&D at Analog Devices, called “The Third Exponential Wave and the Challenges Ahead”. It was great to see, re-affirmed by Dr. Fuller, a lot of my thoughts about the Internet of Things and how it requires new tools in EDA. This, by the way, conveniently t... » read more

Conferences, Education And The Press
By Brian Bailey - 25 Sep, 2014 - Comments: 1

The EDA industry once organized itself around conferences. The Design Automation Conference (DAC) marked the time of the year when new product announcements came out thick and fast, and it was difficult to keep up with the stream of press releases. Companies with nothing to announce were viewed as deficient. New products were demonstrated in secrecy in the back rooms of the suites at the confer... » read more

I Have Seen The Future
By Mike Gianfagna - 25 Sep, 2014 - Comments: 0

We recently concluded an online survey that measured design challenges and general sentiment regarding how they can be addressed, with some specific forward-looking queries. The title of the survey was “Big Data, the Cloud and Internet of (Silicon) Things.” We essentially asked our survey respondents to look into the future. We got an excellent response to this survey, with lots of thoughtf... » read more

Designing In The Dark
By Jon McDonald - 25 Sep, 2014 - Comments: 0

While power optimization has received significant focus recently, it is still largely a hidden cost to most hardware and software engineers. A significant problem is the lack of visibility into the impact of decisions while decisions are being made. Often an engineer working on a system will have no practical way of measuring the impact of their design decisions on the system power consumption.... » read more

Is IC Design Methodology At The Breaking Point?
By Randy Smith - 25 Sep, 2014 - Comments: 0

Evidence is mounting that traditional “waterfall” methods used to develop complex ICs are reaching the breaking point. Consider that today: Some IC designs contain more than 100 [getkc id="43" comment="IP"] blocks that must be integrated from multiple sources Design requirements are constantly in flux Demands for low power and security are increasing as device connectivity grows S... » read more

Leveraging Virtual Prototypes For Hybrid Emulation
By Tom De Schutter - 25 Sep, 2014 - Comments: 0

As highlighted in many of my blog posts, virtual prototyping has really established itself as the key methodology to shift left software development by decoupling the dependency of software development from hardware availability. The success of the “Better Software. Faster!” book illustrates the wide spread interest in the methodology. The success of virtual prototypes also has led users... » read more

Why Multi-Die Integration Really Is On Its Way
By Steve Schulz - 19 Sep, 2014 - Comments: 0

Admit it. You’ve heard a lot about 3D IC’s for years now, and it’s starting to get old. Lots of talk but not much action, you say? Maybe it will never happen, you say? Well, perhaps it’s time to reassess the current situation, reevaluate emerging needs, and reset our “3D” paradigm for the coming multi-die imperative. The problems associated with 3D IC (stacked die) are real and v... » read more

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