category: Low Power-High Performance

category: IoT, Security & Automotive

Designing 2.5D Systems
By Brian Bailey - 15 Mar, 2021 - Comments: 0

As more designs hit the reticle limit, or suffer from decreasing yield, migrating to 2.5D designs may provide a path forward. But this kind of advanced packaging also comes with some additional challenges. How you adapt and change your design team may be determined by where your focus has been in the past, or what you are trying to achieve. There are business, organizational, and technical c... » read more

Ten Reasons 3D-IC Will Profoundly Change The Way You Design Electronics
By Marc Swinnen - 11 Mar, 2021 - Comments: 3

The history of electronic design has been defined by repeated waves of major technological change and accompanying business realignment. Many companies have foundered and disappeared when they were unable to anticipate and adjust to these powerful forces of change. Consequently, I am not alone in believing that now is the time to get ready for the next significant change to your electronic desi... » read more

The EV Era Has Begun: Here Are Five Things We Need For It To Succeed
By Chet Babla - 11 Mar, 2021 - Comments: 0

The EV era has officially begun. General Motors says it will eliminate gas and diesel cars and SUVs from its lineup by 2035 while Ford will go all electric in Europe by 2030. The UK issued plans for phasing out diesel and gas cars by 2035 and then moved it forward to 2030. Fleet customers such as UPS and Amazon are ordering zero emissions delivery vehicles by the thousands and investing in s... » read more

Controlling The Reliability Of Silicon Carbide-Based Devices
By Peter Friedrichs - 11 Mar, 2021 - Comments: 0

The development of wide bandgap silicon carbide (SiC) compound semiconductors has proved to be extremely beneficial for power conversion applications. Capable of switching at significantly higher frequencies, and with higher breakdown voltage characteristics, SiC power transistors are quickly becoming an attractive silicon alternative for high power density and/or high-efficiency power conver... » read more

Domain-Specific Memory
By Brian Bailey - 11 Mar, 2021 - Comments: 2

Domain-specific computing may be all the rage, but it is avoiding the real problem. The bigger concern is the memories that throttle processor performance, consume more power, and take up the most chip area. Memories need to break free from the rigid structures preferred by existing software. When algorithms and memory are designed together, improvements in performance are significant and pr... » read more

An Integrated Approach To Power Domain And CDC Verification
By Kurt Takara - 11 Mar, 2021 - Comments: 0

Reducing power consumption is essential for both mobile and data center applications. Yet it is a challenge to lower power while minimally impacting performance. The solution has been to partition designs into multiple power domains which allow selectively reducing voltage levels or powering off partitions. Traditional low power verification validates only the functional correctness of power... » read more

Tradeoffs To Improve Performance, Lower Power
By Ann Mutschler - 11 Mar, 2021 - Comments: 0

Generic chips are no longer acceptable in competitive markets, and the trend is growing as designs become increasingly heterogeneous and targeted to specific workloads and applications. From the edge to the cloud, including everything from vehicles, smartphones, to commercial and industrial machinery, the trend increasingly is on maximizing performance using the least amount of energy. This ... » read more

Addressing IC Hyperconvergence Design Challenges
By Aveek Sarkar - 11 Mar, 2021 - Comments: 0

Recently in an article titled “A Renaissance for Semiconductors,” my colleague Michael Sanie highlighted some of the trends that are driving next-generation product development. He detailed how designs targeting new applications are innovating through a combination of advanced process node technologies and heterogeneous integration of stacked die/3D/2.5D systems. Additionally, advanced vert... » read more

Die-To-Die Chiplet Communication
By Paul McLellan - 11 Mar, 2021 - Comments: 0

At CadenceLIVE Americas 2020, one of the most viewed videos was by Samsung Foundry's Kevin Yee and Cadence's Tom Wong, titled "Let’s Talk About Chips (Chiplets), Baby…It’s All About D2D!" They went for this title because it reminded them of the lyrics of an '80s song...which they proceeded to sing. Process and packaging trends Tom led off with a look at the trends in semiconducto... » read more

HBM2E Raises The Bar For AI/ML Training
By Frank Ferro - 11 Mar, 2021 - Comments: 0

The largest AI/ML neural network training models now exceed an enormous 100 billion parameters. With the rate of growth over the last decade on a 10X annual pace, we’re headed to trillion parameter models in the not-too-distant future. Given the tremendous value that can be derived from AI/ML (it is mission critical to five of six of the top market cap companies in the world), there has been ... » read more

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