category: Low Power-High Performance

category: Auto, Security & Edge AI

Why Data Center Power Will Never Come Down
By Bryon Moyer - 10 Feb, 2022 - Comments: 3

Data centers have become significant consumers of energy. In order to deal with the proliferation of data centers and the servers within them, there is a big push to reduce the energy consumption of all data center components. With all that effort, will data center power really come down? The answer is no, despite huge improvements in energy efficiency. “Keeping data center power consum... » read more

AI Everywhere: Accelerating Chip Design At Every Node
By Geetha Rangarajan - 10 Feb, 2022 - Comments: 0

Over the last few years, artificial Intelligence (AI) has increasingly played a significant role in the chip development process. But, when people talk about AI-designed chips, it is usually in the context of the latest, cutting-edge designs manufactured at advanced process nodes (7/5nm and smaller) and for good reason. Such designs constantly push the bounds of power, performance, and area (PP... » read more

It’s Official: HBM3 Dons The Crown Of Bandwidth King
By Frank Ferro - 10 Feb, 2022 - Comments: 0

With the publishing of the HBM3 update to the High Bandwidth Memory (HBM) standard, a new king of bandwidth is crowned. The torrid performance demands of advanced workloads, with AI/ML training leading the pack, drive the need for ever faster delivery of bits. Memory bandwidth is a critical enabler of computing performance, thus the need for the accelerated evolution of the standard with HBM3 r... » read more

Spreadsheets: Still Valuable, But More Limited
By Brian Bailey - 10 Feb, 2022 - Comments: 1

Spreadsheets have been an invaluable engineering tool for many aspects of semiconductor design and verification, but their inability to handle complexity is squeezing them out of an increasing number of applications. This is raising questions about whether they still have a role, and if so, how large that role will be. There are two sides to this issue. On one side are the users who see them... » read more

Behold The Dawning Of The Era Of Bespoke Silicon
By John Lee - 10 Feb, 2022 - Comments: 0

The great chip shortage of 2021, which accounted for billions of dollars in revenue loss, hit the auto industry especially hard. What caused the shortage is clear: auto companies miscalculated the impact of the COVID-19 pandemic. While automakers were canceling their chip orders, strong electronics sales continued, leaving automakers at the back of the line for chips when demand for cars reboun... » read more

Calibrate And Configure Your Power Management IC With NVM IP
By Synopsys - 09 Feb, 2022 - Comments: 0

Power Management Integrated Circuits (PMICs) are the first to turn on and the last to turn off in a system. They perform the task of delivering the right voltage to component chips by regulating or boosting the voltage levels to the component chips. Some PMICs are configured once at the factory and an area-efficient OTP NVM is the best choice. When a PMIC is expected to be re-configured mult... » read more

SoC Power Methodology: Are We Lean Enough
By Siemens EDA - 09 Feb, 2022 - Comments: 0

It’s interesting how past lessons learned have such relevance in today’s quest for an optimum system-on chip (SoC) power methodology. Lean manufacturing was introduced by the Toyota Motor Corporation in the 1930s. It is now an essential methodology in most manufacturing and industrial settings. As lean methodology evolved, it extended to software development where its principles have led to... » read more

Realizing The Future Of Fast EV Charging Through CoolSiC Based Topology Design
By Infineon - 09 Feb, 2022 - Comments: 0

While consumers are keen to reduce their carbon footprint, the move to E-Mobility, especially private electric vehicles (EV), is hindered by the limited charging infrastructure, most notably in fast charging. This white paper reviews the charging landscape and examines implementation approaches for fast DC chargers. Specific focus is placed on chargers delivering 350 kW and more for fast electr... » read more

PCIE 6.0 Vs 5.0 — All You Need To Know
By Rambus - 09 Feb, 2022 - Comments: 0

While the PCI-SIG has announced that the release of the PCI Express® 6.0 (PCIe 6.0) specification should arrive in 2022, Rambus is already addressing the needs of early adopters looking for the most advanced PCIe 6.0 IP solutions for their SoC and ASIC designs. You can find all about the new generation specification in the article below. Click here to read more. Article or... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design
By Cadence - 09 Feb, 2022 - Comments: 0

In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

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