category: Low Power-High Performance

category: Auto, Security & Edge AI

The Ethernet Evolution
By Ed Sperling - 01 Mar, 2022 - Comments: 0

Ethernet was expected to be long gone by now, but predictions of its demise were decades premature. John Swanson, senior product marketing manager for high-performance computing digital IP at Synopsys, talks about how Ethernet has evolved over the past 45 or so years from a somewhat “boring” technology to one that is at the forefront of data center performance improvements, with more update... » read more

Research Bits: March 1
By Jesse Allen - 01 Mar, 2022 - Comments: 0

Large-scale phased array Researchers at Princeton University developed a large-scale high-frequency antenna array using thin-film materials. “To achieve these large dimensions, people have tried discrete integration of hundreds of little microchips. But that’s not practical — it’s not low-cost, it’s not reliable, it’s not scalable on a wireless systems level,” said senior stud... » read more

Fuzz Testing Software-Defined Vehicles Using Agent Instrumentation
By Synopsys - 23 Feb, 2022 - Comments: 0

Cybersecurity has become intertwined into each step of the automotive development process. In particular, fuzz testing has proven to be a powerful approach to detect unknown vulnerabilities in automotive systems. But with limited instrumentation, especially on software-heavy systems such as high-performance computers (HPCs), several types of issues go undetected, including memory leaks and case... » read more

Research Bits: Feb. 22
By Jesse Allen - 22 Feb, 2022 - Comments: 0

Dense optical data storage Researchers from the University of Southampton developed a laser writing method for producing high-density nanostructures in silica glass, which could be used for long-term, dense data storage. “Individuals and organizations are generating ever-larger datasets, creating the desperate need for more efficient forms of data storage with a high capacity, low energy ... » read more

Power/Performance Bits: Feb. 15
By Jesse Allen - 15 Feb, 2022 - Comments: 0

3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing, integrating both functional and structural materials into a single printing platform. They used it to create an all-printed piezoelectric wearable device. The stretchable piezoelectric sensors conform ... » read more

Improving PPA In Complex Designs With AI
By John Koon - 14 Feb, 2022 - Comments: 0

The goal of chip design always has been to optimize power, performance, and area (PPA), but results can vary greatly even with the best tools and highly experienced engineering teams. Optimizing PPA involves a growing number of tradeoffs that can vary by application, by availability of IP and other components, as well as the familiarity of engineers with different tools and methodologies. Fo... » read more

What Will Be The Killer App For 5G? Time To Place Your Bets
By Panch Chandrasekaran - 10 Feb, 2022 - Comments: 0

5G is here. But where will its capabilities soar first? Here are my guesses for where the breakthroughs could occur along with factors that might hold it back. 1. Supply Chain. The world’s 5,300+ plus cargo ships carry 90% of the world’s freight and can collectively hold 1.97 billion deadweight tons of cargo. 5G—delivered through private networks or secure slices of public networks—c... » read more

CFD Playing Increasing Role In Design
By Ann Mutschler - 10 Feb, 2022 - Comments: 0

With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Enhancing Datasets For Artificial Intelligence Through Model-Based Methods
By Dirk Mayer - 10 Feb, 2022 - Comments: 0

By Dirk Mayer and Ulf Wetzker Industrial plants and processes are now digitized and networked, and AI can be used to evaluate the data generated by those facilities to increase productivity and quality. Machine learning (ML) methods can be applied to: Product quality classification in complex production processes. Condition monitoring of technical systems, which is used, for examp... » read more

Context-Aware SPICE Simulation Improves The Fidelity Of ESD Analysis
By Neel Natekar - 10 Feb, 2022 - Comments: 0

Electrostatic discharge (ESD) is a major reliability concern for integrated circuit (IC) designs. ESD verification is proving to be a significant challenge at advanced nodes, due to growing IC design complexity and transistor counts. Traditional ESD verification approaches using parasitic extraction followed by SPICE simulation are deficient in providing simulation results in a practical runtim... » read more

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